At a glance
| Booth | L1320 |
| Country | TW |
| Website | adnano-tek.com |
Company profile
AdNaNoTek Corporation specializes in the design and manufacture of fully customizable ultrahigh-vacuum (UHV) systems for research and industrial applications. Its system portfolio combines vacuum deposition, plasma processing, substrate transfer, heating and UHV component technologies so that customers can configure systems around different process requirements. Electron-beam evaporation is one of the company's core deposition routes, with EBS and JEB series tools selected according to customer application requirements. The E-beam platform is described as a multisource deposition tool for materials including high-k dielectrics HfO2, ZrO2, Al2O3 and Sc2O3, metals such as Al, Cu, Ta, Ni, Ag, Au and Ti, and elemental semiconductors Si and Ge. AdNaNoTek Corporation also develops Molecular Beam Epitaxy systems configurable for III-V and II-VI emerging materials and for applications that integrate MBE with e-beam technology. Magnetron sputtering, Pulsed Laser Deposition, thermal evaporation and Ion Beam Sputtering Deposition expand the deposition technology range for semiconductor, metal, dielectric, organic, oxide-semiconductor and other material combinations. The company also builds dry-etching systems using RIE, ICP-RIE, ECR-RIE and IBE process approaches. For multi-chamber process integration, its linear-transfer, automatic-transfer-arm and UHV-transfer-robot technologies move substrates between process or analysis stations without breaking vacuum. The UHV transfer robot is stated to handle wafers up to 12 inch, supporting cluster-style workflows that require substrate movement between vacuum chambers. AdNaNoTek Corporation also manufactures UHV components including Gate Valves, Chambers and Motion Manipulators, drawing on its system-building experience for component design and fabrication. Its UHV component categories include substrate manipulators, customized weldments, isolation gate valves, shielding gate valves, manipulators and transfer arms. For chamber projects, the engineering process starts from customer requirements, proceeds through chamber design and drawings for final confirmation, and includes specification development for geometry and welding procedures. The chamber operation supplies both standard designs and customized chambers, using materials that include SS316L sheet metal and SS316LN CF flanges for vacuum-chamber fabrication.
Exhibits
AdNaNoTek Corporation supplies EBS and JEB Series E-beam evaporators for elemental semiconductor materials such as Si and Ge as well as broader multisource deposition requirements. For magnetron sputtering, DC or RF magnetron sources can be installed according to the application, with substrate holders up to 8 inch. The sputtering configuration can provide substrate temperatures up to 800 oC with a resistance heater, and a laser substrate heater is available as an option. Pulsed Laser Deposition, also described as Laser MBE, is provided for deposition of metal oxides and multi-combination materials, with tools available in different target counts for oxide-semiconductor, metal and related materials. Thermal Evaporator systems are offered for metal deposition and multi-combination low-temperature materials, with configurations that can include different numbers of metal sources. Ion Beam Sputtering Deposition, also called IBSD, is supplied for metal oxides and multi-combination materials, including metal and oxide-semiconductor deposition configurations. For quantum-computing device fabrication, the Josephson Junction Electron Beam Evaporator (JEB) Cluster is a specialized deposition system dedicated to creating Josephson junctions. The quantum-deposition lineup includes JEB-2, JEB-3, JEB-4 and cluster-system options. JEB-4 has four chambers: a load-lock chamber, an ion-beam-etching chamber, a main electron-beam or MBE evaporator chamber, and an oxidation chamber. RIE dry etching uses chemically reactive plasma to remove a deposited coating layer from a substrate. ICP-RIE also uses chemically reactive plasma for layer removal and adds an upper plasma coil together with substrate RF sample bias. ECR-RIE generates chemically reactive plasma using microwave energy and an electromagnet to remove deposited layers from substrates. IBE uses an ion source to create chemically reactive neutral particles for removal of deposited coating layers. The Linear Transfer System moves a substrate to different substations for processing and analysis without breaking vacuum. An Automatic Transfer Arm moves substrates between different process chambers without breaking vacuum, while the UHV Transfer Robot extends automatic transfer to wafers up to 12 inch. The Laser Heater Manipulator provides substrate working conditions up to 1000 degree C in oxygen-rich environments and is described for operation in air and ozone conditions. UHV component supply includes Gate Valves, Chambers and Motion Manipulators, with additional product categories for substrate manipulators, customized weldments, isolation gate valves, shielding gate valves and transfer arms. The company's UHV Tunnel System application list includes UHV STM, Laser Litho, Vacuum AFM, Vacuum Raman, T-ALD and PE-ALD. For chamber fabrication, a standard 14 Ways Cross load-lock design is listed with a Tube OD of 6 inch and SS304L or 316L material options. Spherical chamber options are listed with 12 inch and 18 inch spherical bodies and SS304L or 316L material selections. Box Chamber size options are 500mm x 750mm, 500mm x 1,000mm and 750mm x 1,000mm, with SS304L, SS316L and AL6061 as listed material options. Customized chamber projects can also incorporate features such as an aluminium rack or copper cooling tube within the broader chamber-design and fabrication capability. Across these systems, the company's supply range links deposition, dry etching, vacuum transfer, high-temperature substrate handling and UHV components into configurable research and industrial vacuum solutions.
Capabilities and products
- custom UHV systems
- e-beam evaporation systems
- magnetron sputtering systems
- molecular beam epitaxy (MBE) systems
- pulsed laser deposition (PLD) systems
- thermal evaporation systems
- ion-beam sputter deposition systems
- RIE dry-etch systems
- ICP-RIE dry-etch systems
- ECR-RIE dry-etch systems
- IBE ion-beam etching systems
- vacuum-preserving substrate transfer
- UHV wafer transfer robots
- UHV gate valves, chambers and motion manipulators
- custom vacuum chambers