At a glance
| Booth | L0609 |
| Country | TW |
| Product categories | Defect; Particle; Bump; Contamination Detection, Review or Inspection · Film Thickness; Thickness; Uniformity Measurement; Ellipsometer · Package Inspection; Lead Scanners · Failure Analysis Systems · Functional Test Systems · Printed Circuit Board; Wire Board (PCB or PWB) Test and Repair · Wireless, non-contact Test Systems · Logic Test Systems · Optical Test Systems · Package Test Systems · Assembly · Test Services or Consulting · Sales; Manufacturers Representation or Distributors |
| Website | www.acesolution.com.tw |
Company profile
ACE and TeraView have already qualified interest from several leading semiconductor and IC packaging companies in Taiwan and China. TeraView’s proprietary Electro Optical Terahertz Pulse Reflectometry (EOTPR) technology provides a 5 micron resolution capability in isolating faults within advanced integrated circuits for mobile s and computing, including complex packages such as Package on Package (PoP), flip chip, and 3D package with Through Silicon Vias (TSVs). EOTPR has been widely accepted by advanced IC package failure analysis community, and this technology is ready to be deployed in the high volume manufacturing environment for quality assurance inspection. ACE Solution Co., Ltd. dedicate ourselves to developing Wireless Commutation Total Solution as the company mission since establishment. With the wide product service and professional technology support in Electronics Instrument field, we have become customer’s flexible rental program and system integration solution provider. ACE looks forward to marking gap-free connection with customers in Taiwan, China and globe. Moreover, ACE activity provides valuable solutions to our customers; ACE believes by forward together, we, as a team will reach the synergetic advantages!
Exhibits
Based on the official Overview and product-category listing, the exhibitor presents capabilities aligned with Defect; Particle; Bump; Contamination Detection, Review or Inspection, Film Thickness; Thickness; Uniformity Measurement; Ellipsometer, Package Inspection; Lead Scanners, and related listed categories. The complete official category labels are preserved in the categories field.
Capabilities and products
- 5 micron resolution fault isolation in advanced integrated circuits
- EOTPR fault isolation for 3D packages with Through Silicon Vias (TSVs)
- EOTPR fault isolation for Package on Package (PoP)
- EOTPR fault isolation for flip chip packages
- EOTPR quality assurance inspection for high-volume manufacturing
- Electro Optical Terahertz Pulse Reflectometry (EOTPR) fault isolation technology