At a glance
| Booth | M1154 |
| Country | TW |
| Product categories | Die Bonding; Attach Equipment · Die Sorter; Pick & Place; Flip Chip Placement Systems · Dispensing Systems · Package Handling; Conveying Equipment · Printing Equipment; Screen-printing; Alignment ; Film Printing · Solder Reflow; Soldering & Brazing Equipment · Wafer Mount; Taping Equipment · Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating |
| Website | www.sss-tech.com.tw |
Company profile
Headquartered in Hsinchu, Taiwan, 3S was founded in 1998 with a capital of USD 13M. We have a dedicated team of about 120 professionals focused on the development of smart system, solution, and service for power modules and wafer-level packages. We deliver a comprehensive range of high-reliability systems, including vacuum reflow ovens, formic acid vacuum reflow ovens, and integrated solutions tailored to diverse packaging processes. Trusted by leading companies, 3S is committed to being a reliable partner for all customers worldwide, including IDMs, OSATs, EMS, and fabless companies. #Shaping the Future of Semiconductor Packaging
Exhibits
Based on the official Overview and product-category listing, the exhibitor presents capabilities aligned with Die Bonding; Attach Equipment, Die Sorter; Pick & Place; Flip Chip Placement Systems, Dispensing Systems, and related listed categories. The complete official category labels are preserved in the categories field.
Capabilities and products
- formic acid vacuum reflow ovens
- high-reliability systems for semiconductor packaging processes
- integrated solutions for packaging processes
- smart systems for power modules and wafer-level packages
- vacuum reflow ovens