3D Architech, Inc.

Exhibitor at SEMICON Taiwan 2026 · Booth Q6134

Booth Q6134Country JP2 product topics
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BoothQ6134
CountryJP
Websitewww.3d-architech.com
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Products -Liquid-cooling cold plates for AI data centers 3D Architech fabricates cold plates with microscale structures (minimum feature size: 10 µm), significantly improving cooling performance by reducing thermal resistance and pressure drop. Core Technology - Gel-enabled metal 3D printing technology offers micron-scale design control, delivering exceptional device performance and scalable production. -Micro-design control , enabling improved device performance. -Energy cost saving , achieved by our micro-design control for cold plates in data center cooling

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Provides liquid-cooling cold plates for AI data centers with microscale structures down to a 10 µm minimum feature size to reduce thermal resistance and pressure drop, supported by gel-enabled metal 3D printing with micron-scale design control.

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