At a glance
| Booth | X0008 |
| Country | CN |
| Website | www.meisuoptics.com |
Company profile
Zhongshan MEISU Technology Co.,Ltd. is based in Guangdong, China and specializes in R&D of precise integrated optical sub-assemblies used in optical fiber communication, optical fiber sensing systems, and LIDAR. Its team has more than 20 years of experience in R&D and production of optical components, the company owns multiple patented techniques, and its ultra-precise assembly experience supports customers from design and prototyping through mass production and to provide distinctive products and considerate service. MEISU focuses on the development of techniques for all-optical switching, coherent optical communication, and silicon photonic integration. The company provides precise custom fiber-array sub-assemblies and PM fiber optical devices for areas including integrated optics, sensing, healthcare, and spectroscopy. Its main products cover custom fiber arrays, PBS, optical switches, and other custom optical assemblies, with product groups including 2D Fiber Arrays, Linear Fiber Array, PM Fiber Components, HT Fiber Device, Fiber Optical Switch, and Special Fibre Components. Its solution areas include Silicon Photonics, Optical Communication ( OXC ), Multicore Fiber Application, Optical Transceiver, and Fiber Lens Lensed Fiber. MEISU lists 100 clients worldwide and a monthly production capacity of 10000. MEISU records a Q4 2019 performance score of 3.46 out of 4 for service and response to RFQ and enquiries.
Exhibits
MEISU provides precise custom fiber-array sub-assemblies and PM-fiber optical devices, including 2-dimensional fiber arrays, linear fiber arrays, PM fiber devices, high-temperature optical components, and optical switches for coherent optical communication, sensing, biophotonics, and quantum communication; its PM fiber assemblies are designed for interferometric sensors, integrated optics, and communications, and its 2D arrays provide high positioning accuracy for optical communication and fields such as astronomy. A one-dimensional linear fiber array places M, MM, or PM fibers on a V-grooved substrate at a specified pitch, fixes them with epoxy under a glass cover, polishes the array facet to the required precision, and uses active alignment to maintain fiber alignment and order. Linear arrays can be configured in many cross-sections with different cross-sections at the two ends and can use customizable V-groove blocks and lids, precise fiber-core pitch, multiple fiber types, and flexible fiber counts; MEISU lists connection of up to hundreds of fibers, fiber spacing as small as 62um, ± 0.5µm fiber-positioning tolerance, accurate fiber-core position, and low insertion loss for applications including high-speed transceivers, WSS, electronics, Lidar, and imaging, with designs tailored to technical and economic requirements. MEISU has long manufacturing experience with the 45°FA-MT Fiber Array using 45-degree polishing and flange assembly; the Trench Probe Fiber Array is an edge-coupled array for SiPh wafer testing that can interface with SiPh IC trench structures measuring <50μm in width × 20μm in depth; and the 90° FA-MT Fiber Array bends optical beams for surface-emitting-laser interconnection. The Ultrasmall Fiber Array can use a glass block as small as 2.5mm/1mm/0.6mm; the Lidless Fiber Array targets height-limited or post-polishing applications; the MFD Matched Fiber Array uses small-core fiber spliced to regular SMF or PM fiber; mixed PM, SM, and MM arrays serve coherent transceivers and sensing; Hermetic Sealing Fiber Arrays serve optical transceivers and aerospace and defense uses; and the 192/256ch Fiber Array supports up to 256 channels with fiber-pitch tolerance below 1.0um. V-groove substrates and lids can use borosilicate glass, fused quartz, or silicon; the core pitch is normally 2um larger than the cladding diameter; for regular 125um fiber the core is about 30 microns below the substrate top surface; the thinnest lid is 0.1mm; and the standard minimum distance for 0.9mm protective tubing is 20 mm, with a metal-case option when all fibers need protective tubing. The 2D fiber product group includes 2D Fiber Array, 2D Collimator Array, Fiber Bundle, and Multi-core Pigtail. PM Fiber Components include PM Fiber Array, PM PLC Splitter, PBS/PBC, PM Patch Cord, PM MPO Jumper, Mini PM Coupler (50:50), and Mini PM Coupler (5:95). HT Fiber Device products include HT(260℃）Fiber Array, HT(260℃）Connector, and HT(1000℃） Collimator. Fiber Optical Switch products include Magneto Optical Switch, MEMS Switch, Mechanical Optical Switch, Micro Optical Switch, High Power Optical Switch, and Variable Time-Delay Module. Special Fibre Components include Lensed Fiber, MCF Fanout, MCF Fiber Array, and MCF Jumper. For Silicon Photonics, MEISU supplies linear fiber arrays for coupling between SMF28 and SiPh chips; for Optical Communication ( OXC ), 2D collimator arrays support scaling to large port numbers; multicore fiber, with the same optical path and interference characteristics, is used for optical communication, sensing, fiber imaging, and medical endoscopes; high-temperature-resistant fiber arrays can enable reflow for silicon-photonic integration modules; and lensed fibers in different shapes are supplied for optical communication, fiber lasers, industrial laser systems, and medical laser systems. MEISU also develops optical components beyond traditional optical communication, from common SM fiber arrays for PLC Splitter to custom 2-dimensional arrays for Astronomical Optics and from simply packaged products to hermetic-sealed and high-temperature-survivable products.
Capabilities and products
- high-positioning-accuracy 2D fiber arrays
- linear V-groove fiber arrays
- PM fiber components
- high-temperature fiber devices
- fiber-optical switches
- Trench Probe fiber array for SiPh wafer testing
- MCF fanout, fiber arrays and jumpers
- 192/256-channel fiber arrays