At a glance
| Booth | T9504 |
| Country | US |
| Product categories | Piezo Electronic Components |
| Website | www.xmems.com |
Company profile
xMEMS Labs is redefining sound and cooling with its breakthrough piezoMEMS platform at the intersection of AI, advanced materials, thermal management and acoustics. We created the world’s first solid-state MEMS speakers—powering AI glasses, earbuds, headphones, and smartwatches—and the first μCooling fan-on-a-chip, enabling improved thermal performance in smartphones, AI glasses, SSDs, data center systems and beyond. xMEMS has over 300 granted patents worldwide for its technology.
Exhibits
Join us at booth N2.A75 to experience our innovative thermal and audio solutions in solving the physical bottlenecks of AI hardware Accelerate adoption through the xMEMS and Rayking partnership on Cypress full-range MEMS Speaker The World’s Thinnest Active Thermal Management Solution for Smartphones The World’s Smallest Active Thermal Solution for SSDs Improved spatial audio precision and reduced weight for gamers through a strategic partnership with ODMs AMPACS and Merry Electronics. Next-Level Performance, Small Size, Robustness & Efficiency, Harnessing the Power of Solid-State, All-Silicon Piezo MEMS Technology Deliver enhanced consumer audio experiences with unmatched clarity, detail, and spatial imaging. Add active vent control to balance occlusion effects and active noise canceling (ANC) performance. World’s first 1mm-thin all-silicon, solid state Active Micro Cooling Fan on a Chip for smartphones, tablets and other thin mobile electronics. Solutions Driving the Future of Edge AI Thermal Management and AI Audio Interactions Eliminate thermal throttling, enhance clarity for AI voice interactions, and enable higher-performing, thinner and lighter devices with xMEMS PiezoMEMS components. Our solutions are key enablers in the evolving Physical AI ecosystem, addressing critical hardware challenges: thermal limits, compact form factors, and high-clarity voice interfaces. xMEMS' novel all-silicon, solid-state piezoMEMS platform is transforming consumer electronics industries, spanning personal audio, smartphones, laptops, tablets, AR/VR goggles, and in-cabin automotive entertainment, with nearly 300 granted patents worldwide. xMEMS’ Piezo MEMS Silicon Solutions are based on the inverse piezoelectric effect created by applying an input voltage to make the piezo MEMS material contract or expand, converting electrical energy to mechanical energy. This energy excites an integrated silicon membrane to generate airflow and/or pressure. xMEMS to Showcase Breakthrough µCooling and Sycamore MEMS Loudspeaker Technologies Powering the Next Generation of AI Wearables at CES 2026 xMEMS Raises $21M Series D to Accelerate Commercial Scale of Breakthrough piezoMEMS Technologies for AI-Enabled Consumer Devices
Capabilities and products
- 1 mm all-silicon active micro cooling fan on a chip
- Cypress full-range MEMS speaker
- PiezoMEMS components for AI audio interactions
- PiezoMEMS components for edge AI thermal management
- PiezoMEMS platform for sound and cooling
- active vent control for occlusion and ANC performance
- solid-state MEMS speakers
- μCooling fan-on-a-chip