At a glance
| Booth | T9504 |
| Country | US |
| Website | www.xmems.com |
Company profile
xMEMS Labs,Inc. develops a piezoMEMS platform at the intersection of AI, advanced materials, thermal management and acoustics. The company created solid-state MEMS speakers for AI glasses, earbuds, headphones and smartwatches and a μCooling fan-on-a-chip for thermal performance in smartphones, AI glasses, SSDs, data-center systems and other applications.
Exhibits
The product portfolio includes the Cypress full-range MEMS Speaker promoted through a partnership between xMEMS and Rayking, along with solid-state µSpeakers and PulseAir Speakers. Its solid-state speaker technology is positioned for richer sound, faster response and greater design flexibility, with pro-grade reference sound quality, ultra-fast transient response, low distortion, high fidelity and semiconductor-level consistency and reliability. Solid-State µSpeakers are presented for in-ear monitors, premium earbuds and gaming headphones, while PulseAir Speakers target AI glasses, intelligent eyewear and AI smart wearables with smaller, thinner and lighter form factors that free design space. For gaming audio, xMEMS cites a strategic partnership with ODMs AMPACS and Merry Electronics aimed at improving spatial-audio precision while reducing weight. The audio range also includes active vent control intended to balance occlusion effects with active noise canceling, or ANC, performance. For thermal management, xMEMS offers what it describes as the world's thinnest active thermal management solution for smartphones and the world's smallest active thermal solution for SSDs. Its Active Micro Cooling Fan on a Chip is described as the world's first 1 mm-thin all-silicon solid-state cooling fan for smartphones, tablets and other thin mobile electronics. The cooling and audio components are positioned for edge-AI thermal management and AI audio interactions, including reducing thermal throttling, improving clarity for AI voice interactions and enabling thinner and lighter devices. The company identifies thermal limits, compact form factors and high-clarity voice interfaces as hardware challenges addressed by its components in the developing Physical AI ecosystem. The all-silicon solid-state piezoMEMS platform is presented across personal audio, smartphones, laptops, tablets, AR/VR goggles and in-cabin automotive entertainment. Its Piezo MEMS Silicon Solutions use the inverse piezoelectric effect: an applied input voltage makes the piezo MEMS material contract or expand, converting electrical energy into mechanical energy that excites an integrated silicon membrane to generate airflow and/or pressure. The platform is described as solid-state and all-silicon, combining small size, robustness and efficiency in a semiconductor approach used for both sound generation and active cooling. For consumer audio, the company emphasizes clarity, detail and spatial imaging in addition to the reference-quality and low-distortion characteristics listed for its solid-state speakers. xMEMS µFidelity™ audio technology underpins the company's next-level sound-generation technology and is linked to design freedom in its silicon-based speaker products. PulseAir is specifically positioned to put more sound into less space, using smaller and thinner form factors, lower weight for extended wear and reduced space consumption inside product designs. Across its cooling and audio lines, the company presents the same piezoMEMS platform as a way to address compact device packaging while generating either airflow or acoustic pressure from an integrated silicon membrane.
Capabilities and products
- solid-state MEMS speakers
- MEMS speakers for AI glasses, earbuds, headphones and smartwatches
- micro cooling fan-on-a-chip
- 1mm all-silicon solid-state active micro cooling fan
- active thermal solution for SSDs
- full-range MEMS speaker
- active vent control for ANC