At a glance
| Booth | S7641 |
| Country | TW |
| Website | www.utrun.com/products/un-alsic |
Company profile
UTRUN-TECH CO., LTD. was established in 1991 and is headquartered in the Neihu Science Park, Taipei; it is KIC's Taiwan agent and provides the X⁵ temperature profiling system for reflow-process testing, with 7-channel, 9-channel and 12-channel versions supporting Type-K thermocouples, USB data transfer, real-time RF wireless profile transmission, X⁵ test software, PWI process-window compliance calculation, Navigator Power reflow optimization, ±0.5°C accuracy and a -150°C to 1050°C temperature range. For more than 30 years, the company has sold professional and semiconductor-industry equipment to EMS factories in Europe, America and Japan, with more than 10,000 units sold in Asia; it has branches and service locations in Taiwan, South China, East China, Central China and North China, and serves Taiwan and China as well as customers across Asia, America and Europe. In 2022, UTRUN-TECH CO., LTD. integrated domestic resources and assembled master's- and doctoral-level talent in Taiwan to develop ceramic structures and ceramic-metal composite materials, and in 2025 it established a production base for mass production of aluminum carbide silicon, with initial output of 16 tons and an estimated expansion to 50 tons of production capacity for needs in industrial equipment, semiconductor packaging and energy. Its named operating locations include the Taipei headquarters, Utrun-Tech Co.,Ltd. (Kaohsiung), the CMC Research & Develop Center in New Taipei City and the Materials Manufacturing Center in Taoyuan City. The company emphasizes integrity, sustainable management, customer orientation, service, commitment and responsibility, and says its experience through changes in the electronics and semiconductor high-tech industries has strengthened rapid response and organizational flexibility while its culture stresses mutual respect, accountability, empowerment, innovation and execution.
Exhibits
UTRUN-TECH CO., LTD. supplies Aluminum Silicon Carbide (AlSiC), a ceramic matrix composite that combines aluminum's light weight and machinability with silicon carbide's stiffness, low coefficient of thermal expansion and high thermal conductivity; by adjusting the silicon-carbide particle volume fraction, its CTE can be controlled to match semiconductor chips such as Si, GaN and SiC or ceramic substrates such as Al2O3 and AlN, while thermal conductivity is above 200 W/m·K and density is about 2.9 to 3.1 g/cm³, about one-third that of Cu and one-fifth that of CuW or CuMo. The particle-reinforced AlSiC is described as having a Young's modulus far above aluminum alloy and isotropic thermal, expansion and strength properties; UICA07, UICA08 and UICA09 have respective densities of approximately 3.0, 2.98 and 2.95 g/cm³, thermal conductivity of at least 200 W/m·K, CTE ranges of 7 to 8, 8 to 9 and 9 to 10 ppm/°C, tensile strengths of at least 230, 220 and 200 MPa, compressive strength of at least 500 MPa, hardness of at least 80 HRB and electrical resistivity of no more than 3.0×10^-4 μΩ·cm, for electronic packaging materials, heat-dissipation substrates and high-performance structural components. The KIC Profiler X⁵ range is presented for fast, convenient and precise temperature-profile measurement with simple operation, durable hardware, 24HR customer service, technical, installation, application and hardware support, and a 2-year hardware warranty; the redesigned hardware adds circuit protection for static electricity and leakage, and the 7-, 9- and 12-channel models use standard K-type thermocouples, transfer profile data by USB, support real-time RF transmission to a PC, and can be powered by AAA batteries, rechargeable batteries or USB. X⁵ software measures key profile data including slope, soak time, reflow time and peak temperature, calculates PWI to show whether a profile is within the allowed process window, uses PWI values below 100 for profiles within that window, offers manual prediction for process changes, includes Navigator Power™ to optimize oven settings around process-window center, maximum conveyor speed or minimum energy loss, and provides SPC charts for tracking profile variation. X⁵ specifications include ±0.5°C accuracy, 0.1°C resolution, 0°C to 85°C internal operating temperature, 0.1 to 10 readings/sec sampling, 224,640 data points, USB 2.0 (Std-A/Mini-B), -150°C to 1050°C measurement range, and dimensions of 202.0 x 60.0 x 17.0 mm for 7 channels, 202.0 x 75.0 x 17.0 mm for 9 channels and 208.0 x 98.0 x 17.0 mm for 12 channels; listed heat-shield configurations include stainless sleeves sized 302 x 75 x 23, 312 x 90 x 23 and 323 x 113 x 23 mm plus HT Shield 400 at 298 x 106 x 29 mm, while the full kit includes the profiler, heat shield, software disc, software key, USB cable, AAA batteries, scissors, wireless receiver/transmitter, carrying case, thermocouples, electronic manual, gloves, guide, inspection certificate and USB metal extension cable, with a minimum PC configuration of a dual-core 1 GHz processor, 2 GB RAM, 2 GB disk space, 1024 x 768 display, two USB ports and Microsoft Windows XP/Vista/7 (32/64bit).
Capabilities and products
- Distribution and technical service for reflow temperature profiling systems (KIC)
- Manufacturing of high-thermal-conductivity AlSiC composites