At a glance
| Booth | I2300 |
| Country | TW |
| Website | www.sissca.com/en |
Company profile
SISSCA Co., Ltd. was established in March 2020 and specializes in the research and development of PCB testing equipment. The company positions itself as a Taiwan-based supplier of high-end PCB electrical-testing and substrate-inspection equipment. Its core philosophy is "precise testing and intelligent manufacturing," and its testing solutions are intended for high-end circuit boards used in HDI, 5G, Mini LED and automotive-electronics applications. SISSCA combines intelligent optical-imaging analysis technology, high-precision positioning systems and AI-based statistical algorithms to build automated electrical-testing platforms with high stability and efficiency. The platform can automatically calculate standard test-resistance values, accurately identify abnormal points and increase equipment uptime. The same automated electrical-testing approach is described as significantly reducing the risk of damage to testing probes and PCB boards. The company's technical scope also includes electronic systems, mechanical design, optical technology and low-noise four-wire electrical testing. Its solutions are positioned for demanding PCB and package-substrate applications including AI server boards, high-layer HDI, CSP substrates, ABF substrates and BT substrates. SISSCA says it pursues technological breakthroughs through innovation to help customers improve yield rates and optimize production efficiency in advanced electronics manufacturing. In October 2022, the company acquired SiGold Technology Co., Ltd. and AutoVision Co., Ltd., and in December 2022 it invested in Jiangsu Sissca Co., Ltd. In June 2023, Sissca was officially approved to enter Hsinchu Science Park. In December 2025, Jiangsu SISSCA officially moved into Kunshan Haimei International Intelligent Robotics Industrial Park. The company lists an Operation Center in Hsinchu Science Park and a Sissca (Jiangsu) location in Kunshan City, Jiangsu Province, giving it operating locations in Taiwan and China. Its product navigation identifies HDI 4W AET, CSP 4W AET and Fixture Probe AOIM under the company's four-wire testing and inspection portfolio.
Exhibits
HDI 4W AET is designed for HDI substrates with fine traces, micro via and multilayer stacks, and it is intended for high-speed, high-frequency applications such as mobile phones, tablets and wearable devices. For HDI testing, the FlashTM third-generation system performs a single-point test in a very short time so the overall testing process can be substantially shortened. CSP 4W AET is designed specifically for Chip Scale Package (CSP) and provides full-process verification for high-density pins and very small package dimensions. The FlashTM third-generation system can synchronously measure up to 8 test lines for CSP testing, increasing test efficiency. Fixture Probe AOIM is an automated optical-inspection system for fixture probes and is positioned as an important element in electrical-testing solutions that incorporate AOI information. The fixture-probe inspection machine integrates precision mechanical design with advanced optical technology and is assembled and produced under strictly controlled standards. Its purpose is to support electrical testing that is simpler, faster and more effective by combining automated optical inspection with the electrical-test workflow. Additional public product descriptions in SISSCA's portfolio include a third-generation Flash electrical-measurement architecture, Breakdown voltage warning functions, AOIn optical-inspection related tools, fixture pin-by-pin inspection and FAI first-article puncture inspection.
Capabilities and products
- PCB electrical-test equipment R&D
- HDI four-wire automated electrical testing
- CSP four-wire automated electrical testing
- fixture-probe automated optical inspection
- CSP synchronous measurement of up to 8 test lines