At a glance
| Booth | T9116 |
| Country | TW |
| Website | www.siliconautotech.com |
Company profile
SiliconAuto Taiwan CO., LTD. is a fabless semiconductor company focused on products for things that move, including cars, trucks, two-wheelers, robots and drones. Founded in 2023 and backed by Foxconn and Stellantis, the company was created to simplify automotive electronics as vehicles move toward electric, autonomous and software-defined platforms. It provides access to an advanced semiconductor ecosystem through a growing portfolio of automotive-grade products paired with solutions that simplify integration and help development teams accelerate next-generation vehicles to market. As automotive technology converges with autonomy, SiliconAuto designs chips for vehicles that are becoming more intelligent, connected and embedded in everyday life, including the shift toward vehicles as agents of physical AI. The company's global organization includes a Regional HQ in Germany, a Corporate Center in the Netherlands, a Design Center in India and a Global HQ in Taiwan. Its Hsinchu, Taiwan Global Headquarters oversees corporate strategy, operations and international business development, while the Amsterdam, Netherlands Corporate Center serves as the legal and administrative hub where the company is officially registered and operates in compliance with regulatory requirements. The Taipei, Taiwan Innovation Center is part of the global development network and connects hardware, software and testing teams to accelerate complex vehicle programs across Asia, Europe and North America. The Bengaluru, India Design Center is a global R&D center contributing to silicon design, verification and software development across automotive platforms. SiliconAuto lists ISO 9001 for its quality management system, linking the certification with operational excellence, consistent quality and reliability. It also lists ISO 21434 for certified CSMS implementation supporting secure-by-design automotive IC development and ISO 26262 Process ASIL-D certification for the full development lifecycle and systematic integrity. Its certification and compliance set further includes ISO 14001 for sustainable operations and environmental responsibility and ISO 26262 product compliance for functional-safety-oriented product designs with robust mechanisms. The company also lists IATF 16949 MAQMSR compliance for automotive quality management focused on defect prevention and supply-chain consistency, together with AEC-Q 100 and AEC-Q 006 compliance based on stress-test qualification for IC reliability and environmental robustness. ASPICE compliance is included as a software-process capability framework for high-quality automotive software development. SiliconAuto describes customer focus, innovation and collaboration as principles guiding its work, emphasizing listening and rapid response to customer needs, continuous improvement and alignment with partners around shared goals. Its internal culture is described around open collaboration, mutual support and continuous growth, with employees encouraged to share ideas, challenge existing approaches and contribute to shared team outcomes.
Exhibits
SiliconAuto's offered technology areas include hardware, AI processors, system-on-chip devices, ICs for wired communication, microcontrollers, system boards, evaluation boards and starter kits, AUTOSAR, real-time operating systems, virtualization software and hypervisors, artificial intelligence and embedded vision. Within its automotive semiconductor portfolio, the company groups products and solutions around microcontrollers, in-vehicle networking, high-performance compute and custom silicon-to-system integration. XMotiv™ M3 is a secure MCU for automotive and robotics designed for functional safety, cybersecurity and real-time control; built on the Arm Cortex-M33 core, it provides a scalable control platform for safety-critical embedded systems such as body-control modules and robotic-control nodes. Its 160 MHz Arm Cortex-M33 core provides efficient, deterministic compute for real-time automotive control, enabling smooth actuation, fast response and reliable subsystem behavior. For vehicle connectivity, XMotiv™ M3 integrates 3 × CAN-FD, 8 × LIN, 6 × UART, 6 × SPI and 6 × I²C modules, giving distributed ECUs and smart actuators multiple communication paths for scalable integration. Its safety and security architecture is ASIL-B Ready and includes a PUF-based 128-bit unique ID, ISO 21434 compliance, hardware AES-256 and SHA-512 cryptographic engines, ECC memory protection and Secure Boot for system integrity and trusted operation. The integrated analog and timer subsystems include a 12-bit ADC with 32 channels, a 12-bit DAC, multiple comparators and up to 16 PWM timers for sensing, signal conditioning and actuation in powertrain, body and comfort systems. Power and system management features include Adaptive Clock Gating, a multi-mode PMU with Normal, Standby and Sleep modes, and a low-power 128 kHz oscillator to manage energy use and thermal load across active and low-power states. The XMotiv™ M3 architecture lists a 32-bit Arm Cortex-M33 CPU at 160 MHz with DSP, FPU, DMA and DCLS, together with SRAM 128KB, eFlash 1MB, ROM 64KB, OTP 2KB and ECC protection. Additional security and system blocks include TrustZone, a PUF-based key, TRNG, system MPU, clock and power monitors, CRC engine, JTAG/SWD CoreSight and up to 81 GPIO pins; the interface list also specifies PWM (16) and timers (18 units). Detailed specifications list Cortex M33, DCLS up to 160MHz, 16 DMA channels, SARx1 12bits with 32 single-ended channels, I2C x6, SPI Master x6, AES/AES-CCM/AES-CMAC, ISO-26262 ASIL-B, an operating temperature of -40 to 125 degree-C, core supply of 0.9V (+/- 5%), IO supply of 3V to 5V (+/- 10%) and an LQFP-100 package. For body and cabin systems, XMotiv™ M3 is described for responsive control of windows, locks, HVAC, seating and interior lighting, combining the 160 MHz core with LIN, CAN-FD, SPI and I²C communication, hardware cryptography and ASIL-B functional-safety features. For Adaptive Driving Beam headlights, the platform supports microsecond-level segmentation and rapid beam shaping through the 160 MHz Arm Cortex-M33 core with DCLS, while CAN-FD and LIN connect lighting ECUs and hardware cryptography protects control messages. For safety-control modules, the Arm Cortex-M33 core with DCLS supports fast safety routines and fault detection, AES/SHA engines protect data paths, independent watchdogs and ECC-protected memory reinforce integrity, and an ASIL-B pathway supplies diagnostic coverage. For motor-driven systems ranging from pumps and fans to actuators and robotics, the Cortex-M33 core supports fast control loops while a 12-bit ADC, high-resolution timers and multiple PWM channels provide fine control, with CAN-FD, LIN and SPI coordinating with motor drivers. The MCU platform is positioned for low-latency precision control across vehicle systems, combining automotive-grade safety and security with silicon-to-system support as a foundation for vehicle-system integration. The in-vehicle network portfolio provides high-speed data distribution and control transport over asymmetric links, with scalable bandwidth intended for evolving vehicle architectures while meeting advanced safety and security requirements. High-performance compute products are described as the compute backbone for advanced driving and autonomy platforms, supporting AI workloads, large-scale sensor fusion and centralized decision-making across multiple vehicle lines and evolving software platforms. SiliconPilot™ enables developers to model, test and validate hardware-software systems entirely in a virtual environment for next-generation vehicles and robots, using a high-fidelity digital twin to shorten the development cycle. The software platform also uses digital-twin technology to accelerate chip customization by allowing software development and validation before tape-out. For custom silicon, SiliconAuto's team specializes in automotive-grade application-specific integrated circuits designed to meet performance, cost and safety requirements. Its Advanced Packaging solution uses chiplet integration and 2.5D/3D packaging to combine multiple functions into scalable, high-performance automotive silicon, extending the company's custom solutions from silicon through system integration.
Capabilities and products
- automotive-grade microcontrollers (MCUs)
- in-vehicle network (IVN) connectivity solutions
- automotive high-performance compute (HPC) platforms
- functional-safety and cybersecurity real-time control MCU
- body and cabin real-time control
- automotive safety-critical control
- motor control for automotive and robotics
- digital-twin chip-customization platform
- automotive-grade ASIC design
- chiplet 2.5D/3D advanced packaging