At a glance
| Booth | I2322 |
| Country | TW |
| Website | www.silmore.com.tw |
Company profile
Sil-More Industrial Ltd. was founded in 1995 as a professional integrated total-solutions provider focused on promoting adhesive materials for high-tech industrial applications. Its business introduces domestic as well as well-known American and European materials to meet field requirements in high-tech manufacturing. The company serves electronics, general industrial, automobile, semiconductor, optoelectronics and aerospace industries with material solutions tailored to assembly, protection and thermal-management needs. Sil-More Industrial Ltd. operates its own research and development center and states that it continuously absorbs new professional knowledge and creates new products. It reports more than 10,000 local and international electronics-manufacturing customers and positions professionally integrated total solutions as the basis of those customer relationships. The company presents close technical cooperation with customers as part of its role in developing future technology applications rather than limiting its business to material resale.
Exhibits
Sil-More Industrial Ltd. distributes a broad electronics-material portfolio that includes silicone material, epoxy material, PU material, acrylic resin, hot-melt adhesives, UV adhesives, TC Material, EMI shielding material and solvent-based adhesives in Taiwan and the Greater China region. Its one-stop electronic and optoelectronic material range includes silicone rubber, silicone adhesives, potting materials, coatings and high-thermal-conductivity materials from Dow Corning with stated RoHS compliance and UL approval. Non-silicone products listed by the company include non-silicone rubber, epoxy potting material, UV adhesives with RoHS compliance, PU, cyanoacrylate adhesives, threadlocker material, pipe sealant and thermal paste. The same range also lists LED phosphor, LOCA glue, die-attach material, halogen-free adhesives, solder mask, conformal coating, protective coating and solvent products. Product categories are organized as Adhesives and Sealant, Conformal Coating, Die Adhesive, Encapsulant and Potting, EMI Shielding, Plastic Material, Secondary Optics Material and Thermal Interface Materials. The represented and house brands shown include DOW, H.B. Fuller, LWB, MXBON, DONGWHA, PROTAVIC, SIL-MORE and YINCAE, while SIL-MORE house-brand families include UV-SIL, EP-SIL and PU-SIL. Featured products include SIL-MORE EF 400 A-B Part A black epoxy potting resin in a 5KG-CAN and SIL-MORE EF 400 A-B Part B clear epoxy curing agent in a 600G-CAN with a listed 100:12 ratio. The featured list also includes FONG YONG E 536-H 536 Part H 536 black epoxy potting resin in a 10KG-CAN with a 100:30 ratio and FONG YONG E 536-H 536 Part E 536 black epoxy potting resin in a 10KG-CAN with the same 100:30 ratio. SIL-MORE EPO-SIL EU 220 A-B appears in separate Part A and Part B clear epoxy potting resin products, each listed in a 5KG-CAN, alongside the model SIL-MORE EOX-BAB-EM2R50. Other featured items include SIL-MORE EF 473 A3-B3 Part B3 yellowish epoxy curing agent in a 150G-BT, SIL-MORE EF 473 A3-B3 Part A3 black epoxy potting resin in a 1KG-CAN, a white 5KG-CAN version of SIL-MORE EF 400 A-B Part A, and SIL-MORE EF 473 A1-B1 Part B1 black epoxy potting resin in a 5KG-CAN. The material portfolio is presented for automotive electronics, consumer electronics, general industry, lighting, optical components, semiconductors and solar energy. Alongside this broad material offering, the company continuously introduces and develops green products that meet market demand as part of long-term work toward sustainable development and wider adoption of greener materials. Based on the 12 principles of green chemistry, its green-product catalog is organized around low toxicity, energy saving, reduced auxiliary materials, waste prevention, degradability and recycling to help customers select suitable products and support the electronics industry's move toward net-zero carbon emissions. For electronics applications, it promotes low-toxicity adhesive solutions that meet RoHS and REACH requirements and provides Low VOCs materials based on China GB volatile-organic-compound standards to reduce health risks during operation and air pollution. These green-oriented electronics materials include adhesives and sealants, thermal-management materials, conformal coatings, potting and encapsulation materials, chip-protection materials and auxiliary application materials. To balance energy saving with production efficiency, represented products include ultraviolet-curing, dual-curing, low-temperature-curing and room-temperature fast-curing materials. To reduce component waste and solvent use during repair and disassembly, the research and development center developed a reworkable ultraviolet-curing adhesive for electronic-component edge reinforcement and PCB process protection. For thermal management, Dow provides a reworkable thermally conductive gel for thermal interfaces in smartphone CPUs and chips or 5G communication equipment that can be removed during repair to reduce organic-solvent use. Reworkable PUR adhesive is also used to reduce the need to discard complete component assemblies during assembly and disassembly. Together with 綠世界環保科技, the company developed the PlasFree® series using cassava starch from a non-primary food crop and patented modification technology to produce a thermoplastic starch composite with bio-based carbon content reaching nearly 80%. The thermoplastic starch composite can be processed by blown film, sheet extrusion, bottle blowing, injection and foaming into products such as tableware, straws, eyeglass frames, shopping bags, 3D-printing materials and agricultural film. Under natural composting conditions, the thermoplastic starch composite can decompose 100% into water and carbon dioxide, and it can also be blended with general-purpose plastics to reduce the proportion of petrochemical feedstocks and plastic use. The recycled-plastic offering reprocesses used plastics such as housings, plastic bottles and plastic packaging and is presented as reducing production water use, carbon emissions and energy consumption compared with virgin plastics. Represented PCR recycled plastics carry international recycling certification, can contain up to 100% PCR, and have appearance, color and mechanical properties close to virgin plastic. These PCR materials are listed for consumer-electronics applications such as laptop housings, accessories, packaging dividers and semi-structural components to reduce use of virgin plastic.
Capabilities and products
- electronic adhesives and sealants supply
- electronic encapsulation and potting materials supply
- conformal coating materials supply
- die-attach and chip-protection materials supply
- conductive and thermal-interface materials supply
- Low VOCs electronic adhesive materials supply
- multi-mechanism low-temperature curing adhesive materials supply
- reworkable UV-curing adhesive development
- reworkable thermally conductive gel supply (Dow)
- reworkable PUR adhesive applications
- co-development of PlasFree® thermoplastic starch composites
- PCR recycled plastics agency