At a glance
| Booth | I2322 |
| Country | TW |
| Product categories | Cleaning; Washing Equipment for Assembly & Packaging · Dispensing Systems · Centrifuges · Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive · Molding; Encapsulation; Potting; Resin Materials · Thermal Interface Materials; Heat Sinks · Cleaning Chemicals; Solvents; Strippers · Surface protection material; coatings · Deposition/Target Materials · Sealants; Adhesives; Finishes |
| Website | www.silmore.com.tw |
Company profile
Professional Integrated Total Solutions Provider Sil-More Group was founded in 1995. Our main focus is the promotion of adhesive materials used in high tech Industrial applications, introducing domestic and well known American and European materials to satisfy the field application requirement for adhesive/sealants, encapsulates/potting, conformal coating, die adhesive/chip protectioan, conductive, thermal interface materials and engineering plastics in the electronics, Industrial, automobile, semiconductor, optoelectronics and aerospace industries. We have our own research and development center and over the years we are continuously assimilating new knowledge in the professional field, creating new innovative products. We have more than 10,000 local and international electronics manufacturing customers and we are capable to provide professionally integrated total solutions to them, becoming their most trusted professional supplier. Sil-More group will work closely with you to create a new era of future technology together. Contact Us: | Website: www.silmore.com.tw | [email protected]
Capabilities and products
- adhesive and sealant materials for high-tech industrial applications
- conductive materials
- conformal coating materials
- die adhesive and chip protection materials
- encapsulant and potting materials
- engineering plastics for semiconductor and electronics applications
- thermal interface materials
Related product topics
- Thermal Interface Materials
- Engineering Plastic Stock Shapes
- Thermoplastic and Composite Semi-Finished Products
- Semiconductor Adhesives and Epoxies
- Conductive and Non-Conductive Bonding Adhesives
- Die Attach Compounds
- Molding, Encapsulation And Potting Resins
- Encapsulants and Potting Materials
- Conductive Silver and Copper Paste
- Die-Attach & Underfill Adhesives
- Conformal Coating and Adhesives