At a glance
| Booth | H0034 |
| Country | CN |
Company profile
About QUICK SEMICONDUCTOR QUICK Semiconductor—a wholly owned subsidiary of QUICK Intelligent (SSE: 603203)—is dedicated to the innovation and manufacturing of semiconductor packaging equipment. Driven by the evolving demands of AI-era semiconductor packaging, QUICK Semiconductor has developed a portfolio of advanced equipment, including: Advanced Packaging TCB (Thermo-Compression Bonder) High-Speed Eutectic Die Bonder Die Packaging AOI Micro-Nano Silver/Copper Sintering Equipment Vacuum/Formic Acid Oven These solutions are widely applied in HBM, CoWoS, CPO, Optical Modules, and High-Bandwidth Semiconductors (SiC).
Exhibits
Semiconductor advanced packaging equipment includes Advanced Packaging TCB (Thermo-Compression Bonder), High-Speed Eutectic Die Bonder, Die Packaging AOI, Micro-Nano Silver/Copper Sintering Equipment, and Vacuum/Formic Acid Oven.
Capabilities and products
- manufacturing of semiconductor packaging equipment
- Advanced Packaging TCB thermo-compression bonder
- high-speed eutectic die bonder
- die packaging AOI
- micro-nano silver/copper sintering equipment
- vacuum/formic acid oven
- applications in HBM and CoWoS
- applications in CPO, optical modules and SiC
- wholly owned subsidiary of QUICK Intelligent