At a glance
| Booth | H0034 |
| Country | CN |
| Website | www.quick-semicon.com |
Company profile
QUICK SEMICONDUCTOR is a wholly owned subsidiary of QUICK Intelligent, with the parent company identified as QUICK Intelligent (SSE: 603203), establishing the corporate relationship stated for the semiconductor-packaging equipment business. The company is dedicated to both the innovation and the manufacturing of semiconductor packaging equipment, a two-part focus stated independently in its company materials and used to define the scope of QUICK SEMICONDUCTOR's business. Its equipment development is driven by the evolving demands of AI-era semiconductor packaging, which the company identifies as the demand environment behind the advanced-equipment portfolio it has developed. QUICK SEMICONDUCTOR states that it has developed a portfolio of advanced equipment for semiconductor packaging in response to the evolving demand environment it identifies for AI-era packaging.
Exhibits
Within that advanced semiconductor-packaging portfolio, QUICK SEMICONDUCTOR includes Advanced Packaging TCB (Thermo-Compression Bonder) as the specifically named thermo-compression-bonding equipment item, preserving the full product designation used by the company. The same advanced-equipment portfolio includes High-Speed Eutectic Die Bonder as the specifically named high-speed eutectic die-bonding item listed by QUICK SEMICONDUCTOR for semiconductor packaging. Die Packaging AOI is included as the specifically named inspection-equipment item in the semiconductor-packaging portfolio, with the company presenting it alongside the bonding, sintering, and oven equipment categories. Micro-Nano Silver/Copper Sintering Equipment is another specifically named equipment category in QUICK SEMICONDUCTOR's advanced semiconductor-packaging portfolio, retaining the Silver/Copper material wording used in the product name. The equipment lineup further includes Vacuum/Formic Acid Oven as a specifically named advanced packaging equipment item, with both Vacuum and Formic Acid retained as parts of the company's product designation. HBM is one of the named application areas in which QUICK SEMICONDUCTOR states that these advanced semiconductor-packaging solutions are widely applied. CoWoS is likewise identified by QUICK SEMICONDUCTOR as a named application area in which the same advanced equipment solutions are widely applied. CPO is another explicitly named application area for the company's advanced semiconductor-packaging equipment solutions. Optical Modules are also explicitly included among the named application areas for the advanced equipment portfolio developed by QUICK SEMICONDUCTOR. High-Bandwidth Semiconductors (SiC) are likewise explicitly listed among the application areas in which QUICK SEMICONDUCTOR's equipment solutions are widely applied. QUICK SEMICONDUCTOR presents the five named equipment items as one advanced semiconductor-packaging portfolio whose solutions, taken as a group, are widely applied across the five named application areas.
Capabilities and products
- advanced-packaging TCB thermocompression bonding equipment
- high-speed eutectic die bonders
- Die Packaging AOI
- micro-nano silver/copper sintering equipment
- vacuum/formic-acid ovens