At a glance
| Booth | I3016 |
| Country | TW |
| Website | www.playnitride.com |
Company profile
PlayNitride Inc. was formally established in 2014 by a group whose stated goal was to "Change the World" by introducing new thinking to influence the nitride industry. Through breakthrough innovations and diverse business models, the company describes itself as a leading company in MicroLED technology. It received the 2018 SID Best Prototype Honoree in the I-Zone and the 2019 SID Best Small Booth Award. For the 2019 SID Best Small Booth Award, the company used PixeLED display technology to build a transparent display with a process that transfers RGB MicroLEDs onto a pixel. A MicroLED module TV resulting from an alliance was exhibited at the 2019 CES. PlayNitride Inc. states that it is a partner of global companies including display manufacturers in Taiwan, Korea, and Japan and well-known brand system vendors. The company plans to integrate a MicroLED Display Ecosystem from wafer to system and onward to emerging applications, drawing on its experience in MicroLED displays. It also states that it will continue developing key technologies and providing different MicroLED display solutions to expand the possibilities of MicroLED displays.
Exhibits
PlayNitride Inc. demonstrates new MicroLED display applications over time to help customers explore new product concepts and different development approaches. Its application set includes high-resolution and high-brightness wristband-size wearable displays, high-resolution flexible displays, high-resolution modular borderless or seamless-tiled displays, and ultra-fine-resolution MicroLED microdisplays for AR. The company also presents MicroLED displays with high color saturation and high dynamic contrast among the display concepts it has demonstrated. For automotive use, transparent MicroLED technology can turn windshields and car windows into displays, while flexible MicroLED can support distinctive interior designs and high brightness and contrast can keep displays readable in strong sunlight. PlayNitride Inc. describes high brightness, high contrast, flexibility, transparency, and high reliability as MicroLED characteristics for a broad range of automotive display applications. For wearable devices, high brightness and high contrast help maintain display clarity outdoors or under strong light so users can read information quickly and avoid excessive distraction, while low power consumption can extend use time through appropriate design. For large displays, PixeLED Matrix technology uses modular design to tile displays in various sizes and aspect ratios, combining borderless or seamless tiling with high-definition viewing at close range. For conventional mid-small-size displays, self-emissive MicroLED can provide low power consumption and high dynamic contrast, while high transparency can enable distinctive handheld applications. With a flexible driving backplane, MicroLED can form flexible displays for curved surfaces and foldable screens. For AR, PlayNitride Inc.'s µ-PixeLED technology combines miniaturized MicroLED chips with a silicon-wafer driving backplane to provide AR microdisplays with more than 4000 ppi. MicroLED technology miniaturizes the LED structure by removing the LED package and substrate so the LED device can be reduced to less than 50μm, leaving the epitaxial film and enabling light, thin MicroLED chips suitable for mass transfer and different display pixel sizes. A MicroLED display combines LED miniaturization and arraying by mass-transferring and directly bonding MicroLED chips onto a driving backplane that contains circuit structures. Micron-scale MicroLED chips can be used in watches, mobile phones, cars, computer screens, TVs, AR/VR, and other applications across different sizes, unlike ordinary large LEDs that are limited to large video walls. With TFT-driven PixeLED Display technology, MicroLED can be used for transparent displays, curved PixeLED Film, and other common display applications. With PCB-driven PixeLED Matrix technology, MicroLED can be tiled without borders into PixeLED Tile displays of arbitrary sizes and aspect ratios. With silicon-chip-driven μ-PixeLED technology, ultra-high brightness and ultra-fine image quality support applications in AR glasses and projection HUDs. In MicroLED display production, R, G, and B chips are transferred from their respective epiwafers to a temporary substrate and arranged at positions matching the display pixel size before the subsequent mass-transfer process. The arranged temporary substrate is called COC, or Chip On Carrier, and is described as a key process in MicroLED production. Micron-scale MicroLED chips combine high brightness and high reliability to make transparent displays with high transparency and enable a range of transparent-display applications. The application pages also list ultra-low power consumption, ultra-high brightness, ultra-high resolution, great reliability, fast response time, and flexibility as MicroLED characteristics.
Capabilities and products
- More than 65% high transparency MicroLED display
- High resolution and high brightness wearable Micro LED display
- High resolution flexible MicroLED display
- High resolution borderless modular Micro LED display
- Ultra-fine resolution MicroLED micro-display for AR
- MicroLED chip mass transfer process
- MicroLED Chip On Carrier (COC) process