ORO

Exhibitor at SEMICON Taiwan 2026 · Booth R7312

Booth R7312Country KR8 product topics
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BoothR7312
CountryKR
Websiteen.orocorp.co.kr
Exhibitor profile

Company profile

ORO was founded in 2021 and develops surface-treatment technologies for silicone rubber sockets used in semiconductor testing, while participating in continuous research and productivity-improvement activities and entering the conductive-powder market for semiconductor testing. ORO is a specialized R&D materials company that develops and supplies new materials required by advanced IT-device industries, using accumulated expertise in shape-control technology for fine magnetic powder and uniform surface treatment of conductive-powder surfaces. The company also operates as a metal-plating company and manufactures functional powders and related material technologies, with work focused on composite-material and advanced-solution applications. Its operating priorities include continuous product development, customized-order production and functional-powder manufacturing, providing a development and production framework for semiconductor-test and advanced-device material requirements. ORO also lists quality first, sustainable development, and advanced equipment and technology among the principles and capabilities supporting its materials-development activities. Through this combination of powder shape control, surface treatment, plating and functional-powder manufacturing, the company develops material solutions for PCR sockets and other advanced IT-device applications.

Exhibitor profile

Exhibits

ORO supplies conductive powder used in PCR sockets and also accepts technical inquiries concerning silicone rubber socket molding machines, supporting customers working with conductive-rubber socket production and semiconductor-test applications. Its product and technology range includes PCR Socket, Nickel Powder, PCR Socket Conductive Powder, surface treatment, and powder-size measurement and precision analysis using a Scanning Electron Microscope. A PCR socket, or Pressurized Conductive Rubber socket, is a semiconductor test socket used particularly for IC testing where reliable contact between the IC and test equipment is required, and it uses pressure contact rather than soldering or fixed mounting. The pressure-contact mechanism allows repeated testing without damaging IC leads or pads because electrical connection is made through applied pressure instead of permanent soldered connections. PCR socket design is intended to minimize contact resistance for accurate and repeatable signal transmission and to maintain performance after thousands of tests, supporting use in automated testing environments. The socket provides alignment for accurate contact and compatibility with different IC packages, and it is designed to remain stable under different temperature and environmental conditions for burn-in testing. In IC production and quality control, PCR sockets allow electrical and functional testing without permanent soldering, providing a reusable test connection between devices and test equipment. Because of their low contact resistance, PCR sockets are also used for high-frequency and high-speed testing where signal integrity is important. For burn-in testing, PCR sockets can operate at the elevated temperatures used to accelerate aging, making them suitable for semiconductor stress-test conditions. ORO's Nickel Powder is used in silicone rubber sockets, where the ferromagnetic properties of nickel are important to magnetic forming processes. PCR Socket Conductive Powder is described as nickel powder with a Ni Core and electroplated metal on the outer surface, combining a nickel-powder core with a plated conductive exterior. The surface-treatment process can plate silver or gold onto the exterior of nickel powder to a desired thickness, providing controlled metal coating on the conductive-powder surface. For analysis, ORO uses a Scanning Electron Microscope for powder-size measurement and precision analysis, supporting characterization of the powder products used in these semiconductor-test materials. The supply scope also includes functional powders and material technologies for composite-material and advanced-solution applications, extending the company's metal-plating and powder-manufacturing work beyond a single socket component.

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