At a glance
| Booth | I3204 |
| Country | TW |
| Website | omsure.com |
Company profile
OmniMeasure Technology Inc. was spun off from ITRI in 2024 and is dedicated to advancing measurement technologies, with a focus on Through Silicon Via (TSV) and Through Glass Via (TGV) solutions. Its metrology portfolio includes full-wafer TSV depth-uniformity measurement, critical-dimension metrology, and film-properties analysis tools intended to help users manage the quality of advanced chip production. The company also offers the TGV 3D Viewer, which can identify detailed via shape, critical dimensions, and via-wall waviness or roughness for TGV structures. OmniMeasure describes its optical measurement innovations as non-destructive and high-throughput, positioning those characteristics as a way to provide production metrology without damaging the measured structures. Its stated mission is Integrated Metrology for Production, with an emphasis on Smart and Non-Destructive Metrology for Advanced Process Control.
Exhibits
ViaMaster is an automated metrology system developed by OmniMeasure Technology Inc. for semiconductor advanced packaging and 3D IC and measures Through Silicon Vias (TSVs) with aspect ratios of 30 or higher. Using non-destructive optical technology, ViaMaster provides high-resolution, fast, and reliable measurements intended to help customers control critical dimensions during manufacturing and improve product yield and process stability. The system is positioned for TSV structure measurement in advanced packaging, where TSVs create metallized vertical vias through silicon wafers to form interlayer connections that increase integration and reduce product size. As TSV structures become smaller and more complex, the measurement challenges identified for ViaMaster include precise control of via depth and diameter, control of via-to-via pitch, and measurement of high-aspect-ratio structures. These process challenges call for high-precision metrology during manufacturing so process parameters can be monitored and adjusted in real time to maintain TSV structure quality and reliability. ViaMaster supports high-speed automated measurements, placing automated throughput among the system's stated advantages for production metrology. Its measurement method is non-contact optical metrology, supporting non-destructive inspection of TSV structures without physical contact with the measured feature. High precision and high resolution are also listed as product advantages for measuring the depth, diameter, and other critical dimensions of increasingly demanding TSV structures. ViaMaster integrates multi-parameter measurement in one metrology system so multiple TSV-related parameters can be evaluated within the same automated measurement workflow. The system is intended for use at critical process stages where measurement results can support manufacturing control and timely process adjustment. The system is designed to detect deviations during manufacturing so users can make necessary adjustments and maintain the precision and reliability of TSV structures. By combining real-time deviation detection with automated optical measurement, ViaMaster is intended to improve product yield and reduce production costs while supporting stable TSV processing. The product page also identifies a TSV Depth Distribution Map and a TSV Metrology Module as elements associated with the ViaMaster measurement offering.
Capabilities and products
- full-wafer TSV depth uniformity metrology
- critical dimension metrology
- film properties analysis
- TGV 3D via-shape identification
- TGV critical-dimension and via-wall roughness metrology
- high-aspect-ratio TSV metrology up to AR 30+
- non-contact optical metrology
- integrated multi-parameter measurement