At a glance
| Booth | I3204 |
| Country | TW |
| Product categories | Film Thickness; Thickness; Uniformity Measurement; Ellipsometer · Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation · Measurement; Inspection Service |
| Website | omsure.com |
Company profile
Spin-off from ITRI in 2024, OmniMeasure Technology Inc. is dedicated to advancing measurement technologies, focusing on providing world-leading Through Silicon Via ( TSV ) and Through Glass Via ( TGV ) solutions. Our TSV depth uniformity metrology for full wafers, critical dimension metrology, and film properties analysis tools effectively help users manage the quality of their most advanced chip production. Additionally, our newly announced TGV 3D Viewer can identify detailed via shape, critical dimensions, and via wall waviness or roughness. OmniMeasure’s optical innovations deliver non-destructive and high-throughput measurements, providing unparalleled value to our partners. Our mission is to provide our customers Integrated Metrology for Production, dedicated to Smart and Non-Destructive Metrology for Advanced Process Control. For more information about OmniMeasure's capabilities, please visit https://www.omsure.com.
Capabilities and products
- TGV 3D Viewer for via shape and critical-dimension inspection
- TSV depth uniformity metrology for full wafers
- Through Glass Via (TGV) metrology solutions
- Through Silicon Via (TSV) metrology solutions
- critical dimension metrology
- film properties analysis tools