At a glance
| Booth | Q5640 |
| Country | TW |
| Website | www.ofunatech.com |
Company profile
OFUNA TECHNOLOGY Co.,Ltd. was established on February 25, 1991, and operates a Taichung factory and a Taoyuan office in Taiwan. Its facilities are described with 3800 pings of land and 3200 pings of building area for its fine plant. Since its inception, the company has worked in professional service markets for repair and maintenance of PCB / LCD / SMT / semiconductor peripheral equipment. In recent years, it has also provided holistic information technology and automation services, while committing R&D to specialized automation equipment and e-commerce information services. The company describes itself as a supplier of equipment and process solutions for microstructuring applications. Its business philosophy emphasizes integrity, pragmatic entrepreneurship, professionalism and innovation, together with systematic electronic resource planning and stronger integration across vertical and parallel markets. OFUNA TECHNOLOGY Co.,Ltd. is a Taiwan-based company focused on laser precision processing and equipment application integration for semiconductor, IC substrate, PCB, advanced materials and electronics manufacturing customers. Its laser processing capabilities include CO2, UV, Pico UV and Pico Green, supporting micro-hole drilling, blind-via processing, cutting, window opening, film removal, surface treatment and special-process verification. Customer support can extend from sample testing and process parameter setup through pilot production and mass production introduction. The company also provides PCB production equipment, spindles, parts, consumables, equipment maintenance and laser processing services.
Exhibits
The product range covers Semiconductor Laser Processing Machine, Laser Process Machine, Drilling Machine, Routing Machine and SPINDLE equipment for circuit-board manufacturing and related processing applications. Solution and service categories include Spindle Upgrade Service, Equipment Effectiveness Improving Service, Drilling Process Solution, Routing Machine Solutions and Laser Processing Machine Solutions, with special-process high-precision alignment compensation and high-precision depth control with vacuum table mounting also listed. PICO Green Laser Micro Via processing uses ultrafast-laser characteristics to optimize hole quality. Laser processing services for Probe Card applications provide laser via forming capability and high-precision specifications. For FOPLP, the service range includes stable-quality laser drilling with a maximum processing range of 700x800mm, while a separate FOPLP laser processing machine is listed with a large table size of 700x800mm for high-precision processing. Ceramic laser processing supports blind-via and through-hole processing with Aspect ratio 7.0. ABF blind-via processing can use CO2, UV and ultra-short-wave lasers, with a minimum processing hole diameter of φ10μm. Drilling and routing technical support for Cavity applications covers cavity processing for embedded active/passive-device substrates. Special-shaped V-CUT processing is provided for Optical Module substrates. Blind Routing creates localized precision cavities or grooves for component installation, optoelectronic channels, shielding, heat dissipation or structural weight reduction. Advanced drilling support includes flip drilling, back drilling and precision microdrilling. Automation planning for the drilling process covers Factory Automation, FA. High-quality metal-parts contract processing includes turning, milling, grinding, vacuum heat treatment, ultra-deep cryogenic treatment and OEM parts processing. CO2/UV laser processing and testing services cover PCB HDI, ABF and ceramic substrate processing. Whole-plant performance improvement covers machine upgrades, modifications and system management intended to raise processing efficiency and capability as order patterns change and production-capacity needs increase. Machine upgrading service is presented for improving PCB drilling efficiency and capability while responding to changing order patterns and added production-capacity needs. Equipment Upgrade Solutions apply to PCB / LCD / SMT / semiconductor optical communication industries. ATBC / AUTO Tool Bush Changer is listed for small-bore processing accuracy upgrades. After using ATBC, the stated purpose is improving efficiency. Performance Upgrade services are intended to help customers upgrade equipment performance, and the owned brand Vela is identified within the offering. Custom service capability is described as providing more equipment service technologies. Spindle Upgrade Service covers Automotive board / Communication board / PC Products as well as Smart Phone / Tablet PC Product using the HDI Process. For ND-N TYPE/H916B modification, processing efficiency upgrades are stated at 12~20%; the same item supports small-diameter processing with Drill φ0.15mm, processing accuracy, Feed rate UP and PCB processing quantity UP. A separate spindle-upgrade item covers 300k rpm spindle exchange with 200k rpm spindle support, Drill Shank 3.175mm, Mobile / BGA / Automotive board applications, increased equipment utilization rate and reduced spindle running cost. Routing process solutions include the New Concept Routing Machine ECO-RM series for high precision and quality applications. The ECO-RM series lists a Ball Bearing Spindle, Model FR06, and an optional Air Bearing Spindle, Model F80P. Its multi-function applications include CCD Camera compensation and PCB Thickness, while SLM Function provides high precision depth control. The same routing range states high precision routing capability and lists related equipment including ECO-RMxE Series, F80P/F12 SPINDLE and FR06 SPINDLE. Related routing solutions also include special-process high-precision alignment compensation, high-precision depth control with vacuum table mounting and high-capacity multi-functional production for a universal machine. Semiconductor laser processing machine offerings include a laser processing machine for FOPLP, a UV Laser Processing Machine Single-Axis with EFEM and a UV Laser Processing Machine Dual-Axis with EFEM. The FOPLP machine is listed with a large table size of 700x800mm for high-precision processing. One listed laser specification states high beam quality with M² < 1.2. The Single-Axis with EFEM item includes a high-resolution visual recognition module. Spindle Upgrade Service is associated with PCB / LCD / SMT / Industry and with Automotive board / Communication board / PC Products. For Smart Phone / Tablet PC Product (HDI Process), the spindle-upgrade page repeats the 12~20% efficiency-upgrade item, Drill φ0.15mm support, processing accuracy, Feed rate UP and PCB processing quantity UP. The service taxonomy groups Spindle Upgrade Service, Equipment Effectiveness Improving Service, Drilling Process Solution, Routing Machine Solutions and Laser Processing Machine Solutions, with Circuit Board Manufacturing as an application.
Capabilities and products
- supply of semiconductor UV laser processing machines with EFEM
- supply of FOPLP laser processing machines
- supply of PCB mechanical drilling machines
- supply of high-precision PCB routing machines
- CCD alignment compensation for PCB routing machines
- precision depth control for PCB routing
- supply of ball-bearing spindles
- supply of air-bearing spindles
- PCB drilling spindle upgrades from 200,000 to 300,000 rpm
- ATBC automatic tool-bush changer retrofits
- CCD-function retrofits for PCB equipment
- picosecond green-laser drilling
- laser-hole machining of probe cards
- 700×800mm fan-out panel-level packaging laser-hole machining
- ceramic laser blind-via and through-hole machining with aspect ratio 7.0
- ABF laser blind-via machining with a minimum diameter of φ10μm
- CO2/UV contract laser processing and testing for PCB HDI
- cavity machining of embedded-component substrates
- special-shaped V-CUT machining of optical-module substrates
- precision blind routing of PCBs
- technical support for PCB flip drilling and back drilling
- technical support for precision PCB microdrilling
- factory-automation planning for drilling processes
- contract turning of metal parts
- contract milling of metal parts
- contract grinding of metal parts
- contract vacuum heat treatment of metal parts
- contract deep cryogenic treatment of metal parts
- PCB machine upgrades, retrofits and system management
- repair and maintenance of PCB/LCD/SMT/semiconductor peripheral equipment
- information-technology and automation integration services