NTS Technology Co., Ltd.

Exhibitor at SEMICON Taiwan 2026 · Booth J2539

Booth J2539Country TW9 product topics
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BoothJ2539
CountryTW
Websitewww.nts-tec.com
Exhibitor profile

Company profile

NTS Technology Co., Ltd. is a laser-processing system integrator located in Hsinchu science park, Taiwan. Its proprietary control system coordinates mechanics, electrics, laser, and optics in real time to improve processing efficiency, accuracy, and quality. The company develops dedicated laser-processing processes for different materials and matches the required components and process designs to material characteristics and target quality. Its technical team covers laser, optics, manufacturing process, mechanism, electric control, and software disciplines, with more than ten years of laser and automation-equipment development experience. The proprietary laser direct imaging system addresses stitching in laser circuit dry etching and patterns ITO, AgNW, CNT, conductive polymer, PI film, printed Ag, and other thin-film materials. For this direct-imaging work, the stated performance is 0um stitching error, overall accuracy ≦±5um, and L/S ≦10um, making the system suitable for prototyping diverse or novel products. The company’s project fields include FPC, PCB, PI, ITO and transparent conductive films, ceramics, LTCC, glass, semiconductor packaging and testing, Si wafer marking, solar processing, aluminum drilling, and PSO control. Its service scope includes laser processing, laser-machine development and design, contract laser processing, laser-control software development, automation equipment, and laser-machine refurbishment.

Exhibitor profile

Exhibits

For TGV glass drilling, glass modification and etching can achieve a 10:1 depth-to-width ratio, hole diameter <100um, and chipping free processing. The laser-processing capabilities include processing of flexible and brittle materials, laser micro-drilling, laser micro-cutting, laser surface treatment, flying-optical-path processing, laser-control software development, and laser-machine refurbishment. Product equipment listed by NTS Technology Co., Ltd. includes a high-precision laser drilling machine, a fully automatic film-thickness measuring instrument, a TGV laser glass-modification machine, a CO2 snow cleaning machine, a laser glass-cutting machine, a laser drilling and engraving machine, a ceramic-processing machine, and a laser flying-path circuit-etching machine. Its application examples cover panel-level packaging FOPLP, marking, drilling, trimming, FPC flexible-board processing, flexible-board cutting and drilling, PCB cutting, PI film cutting and drilling, ITO transparent-conductive-film processing, and copper-plated conductive circuits. Additional application areas include ceramic drilling, LTCC processing and drilling, glass cutting, TGV glass drilling (Through Glass Via), semiconductor package-test work, marking Si Wafer, solar patterning, solar ablation, aluminum-plate drilling, and PSO control. For transparent conductive films, the company uses laser light to etch the transparent conductive film. For semiconductor marking, precise laser control can realize marking applications with character height of less than 50um. For package-test applications, a laser can open a hole in Epoxy package material to expose the underlying Cu after chip packaging, after which the hole can be filled with Cu. The works portfolio also lists a laser ceramic-substrate processing machine, an FPC cutting machine, a CO2 snow cleaning machine, and a film-thickness measuring instrument alongside the company’s drilling, cutting, etching, and glass-processing equipment. Across these offerings, NTS Technology Co., Ltd. supplies both laser-processing technology and the machine, control-software, automation, and contract-processing capabilities needed to implement those processes.

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