基本資料
| 攤位 | S7339 |
| 國別 | TW |
| 產品分類 | Die Bonding; Attach Equipment · Die Removal Equipment · Die Sorter; Pick & Place; Flip Chip Placement Systems · Dispensing Systems · Marking; Imprinting; Labeling Equipment · Solder Reflow; Soldering & Brazing Equipment · Wafer Level Bonders · Wire Bonding Equipment · Welding Equipment · Wafers · Epitaxy Equipment; Epi Reactors; Molecular Beam Epitaxy (MBE); Atomic Layer Epitaxy (ALE) · Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive · Molding; Encapsulation; Potting; Resin Materials · Alignment Film Materials · Spacer Materials · Materials, Nanotechnology · Substrate Materials · Test Sockets; Contactors and Contact accessories · Gaskets; Seals; O rings; Elastomers; Resins · Exposure; Illumination Sources - Laser; Lamp; X-ray & other · Optics; Lens Products; Auto-Focus Systems · Plasma Sources; Controls; Monitoring; Diagnosis · Welding; specialty welding services · Associations; Trade or Industrial |
公司簡介
NIKEETECH CO., LTD. 是一家台灣登記公司，與電子設備及半導體零組件經銷相關。公司設於新竹縣，成立於 2015 年，並具進出口登記。業務涵蓋電子設備批發，包括 electronic switches、vacuum tubes、semiconductor devices、microchips、integrated circuits 與 printed circuit boards。
能力與產品項目
- die bonding 與 attach 設備
- die sorter、pick-and-place 與 flip-chip placement 系統
- die 移除設備
- solder reflow、焊接與 brazing 設備
- 半導體元件、microchip 與 IC 配銷
- 標記、壓印與貼標設備
- 點膠系統