At a glance
| Booth | Q5452 |
| Country | TW |
| Website | www.newsmart.com.tw |
Company profile
New Smart Technology Co., Ltd was established in 2015 and focuses on AI algorithms and optical imaging technologies. Its solution portfolio includes AI object recognition, AI defect classification, AI review and AI knowledge management systems; 2D and 3D optical inspection and 3D structured-light/ToF optical systems; and camera-module image inspection, 3D sensing impact detection and AR-module image inspection software. The company lists AI Box, AI edge computing systems, AI electronic fences, AI behavior recognition, Smart Camera, silicon photonics AA and smart manufacturing system integration among its future development plans. New Smart Technology Co., Ltd was founded with its original headquarters in Taipei and relocated its headquarters to Tai Yuen Hi-Tech Industrial Park in Hsinchu, where its current headquarters is identified. The company describes more than ten years of expertise in optical imaging products and a team with design-to-production experience across optics, mechanics, electronics, software, manufacturing and automation, supporting integrated solutions and technical support for customers. Its research and development focus covers optical imaging technologies as well as optical products, automotive electronics, automation equipment, technical solutions and consulting services. In 2016, the company established a Taichung branch, sold its first MTF sorting machine and lens single-piece assembly machine, sold complete automotive-camera-module testing lines and smartphone optical image stabilization testing machines, and acquired HyVision technical agency rights. In 2018, it established a Shenzhen branch and entered the Japanese automotive camera-module supplier market after implementing an ERP system and selling complete CCM testing equipment. In 2019, it entered the global contract-manufacturing equipment supplier market with wide-angle six-axis AA machines and delivered 3D sensor-module testing equipment to leading global smartphone manufacturers and major 3D sensor-module companies. In 2020, it launched the first VCSEL AA equipment in Taiwan, applied AI technology to PCB AVI re-inspection, completed an employee stock-option issuance and increased Series A funding to NT$ 123 million in capital. In 2021, it launched an IP-camera comprehensive testing solution delivered to major EMS manufacturers, a VCSEL semiconductor testing solution delivered to leading packaging manufacturers, PCB shrinkage measurement delivered to leading domestic PCB manufacturers, and what it describes as Taiwan's first PCB 3D hole-depth measurement solution. In 2022, the company launched semiconductor wafer AOI + AI inspection equipment, implemented a smart-manufacturing SECS/GEM upgrade solution, initiated a public-offering plan and received investment from Taiwan-Asia Semiconductor Corporation. In 2023, it launched the EDC process-analysis tool software IDAS, launched a metaverse AR/VR testing solution and established a Hsinchu branch. The company records relocation of its headquarters to Tai Yuen Hi-Tech Industrial Park in Hsinchu in 2024, registration on the Emerging Stock Board in 2025 and a TPEx listing milestone in 2026. Its listed operating locations are Hsinchu Headquarters, Taipei R&D Department, Taichung Office and Shenzhen Branch.
Exhibits
The defect-classification offering automatically classifies product defects, reduces the time and cost of manual inspection and judgment, generates detailed defect-classification reports and presents data graphically. Its wafer-inspection system supports high-speed fly capture with simultaneous front/back wafer inspection and uses multiple light-source groups so different illumination types can be selected according to defect characteristics to improve defect-detection capability. The wafer-inspection configuration is stated for 4~12” wafers as well as coating-defect inspection on CIS and glass substrates, and it can be combined with an AI system for defect classification. Optional IDAS (Inspection Data Analysis System) provides statistical analysis of inspection data, while the software is described as assisting process optimization. The AA equipment includes a dual-AA system that can use Lens or Sensor as the reference, allows a Collimator or Relay factory configuration, and includes a high-speed, high-accuracy six-axis AA module. The listed automation and imaging functions also include a fully automatic loading/unloading system, a plasma cleaning system, a black/white field image testing system and the NST high-speed six-axis image-recognition system. For smart-manufacturing system integration, New Smart Technology Co., Ltd develops automation scripts according to factory equipment and process requirements to improve on-site operating efficiency. RCM/OCR scripts can arrange highly repetitive actions to improve work accuracy, reduce personnel operation and judgment errors, reduce work errors and risks, and improve yield rates. Its SECS/GEM function is developed according to each process and equipment flow so communication between equipment and the host system complies with semiconductor equipment communication specifications. SECS/GEM can also be customized to process and equipment functions to meet factory-side requirements for data collection, recipe control and trace data.
Capabilities and products
- AI object recognition system
- AI defect classification system
- AI review system
- AI knowledge management system
- 2D and 3D optical inspection system
- 3D structured light/ToF optical system
- camera module image inspection software
- 3D sensing impact detection software
- AR module image inspection software
- high-speed simultaneous front/back inspection for 4~12” wafers
- coating defect inspection for CIS and glass substrates
- IDAS inspection-data statistical analysis
- high-speed high-precision six-axis AA module
- fully automatic loading/unloading system
- plasma cleaning system
- black/white field image testing system
- high-speed six-axis image recognition system
- RCM/OCR automation script development
- SECS/GEM customization and equipment-host communication integration
- dual AA active-alignment system