At a glance
| Booth | N0676 |
| Country | TW |
| Website | www.mirle.com.tw |
Company profile
Mirle Automation Corporation was spun off from ITRI's mechanical lab in 1989 to provide factory automation solutions to growing traditional industries. Over more than 35 years, the company states that it has become a system integration partner for major semiconductor and LCD companies. Its factory-automation direction has moved from pure equipment automation toward data-driven intelligent automation, with software applications identified as a core element of future smart manufacturing. Mirle Automation Corporation can collect factory data to create Cyber Physical Systems that connect physical operations with a digitized representation of the factory. Those digitized systems analyze factory big data to support production forecasting, equipment health prediction, tool-efficiency improvement and quality virtual metrology. For backend OSAT in the post-Moore era, the company combines traditional AMHS with customized intelligent services such as Digital Twin, Virtual Metrology and Intelligent Prediction. Its semiconductor intelligent-factory approach places Stocker, OHT, AGV, EFEM, Tower Stocker and Lifter equipment within backend package-automation systems. Mirle Automation Corporation states that total-plant integration can help manufacturers use limited production-line space more efficiently, move toward unmanned factories and receive more intensive custom-made design services. For the photoelectric panel industry, the company develops cleanroom automatic storage and retrieval systems for different glass-panel sizes and describes solutions for G5~G10.5 panels with wire/normal CST storage and handling. Its Intelligent Manufacturing CPS Solutions integrate Operation Technology (OT), Information Technology (IT), Artificial Intelligence of Things (AIoT) and CPS-related Digital Twin technology, with results displayed on a War Room situation board for real-time and accurate management information. The Intelligent Factory Logistics Solutions include simulated production before factory construction together with optimization of warehouse management and logistics systems. Through Technical Analysis Services, Mirle Automation Corporation uses independent R&D production lines and analyzes airflow, logistics flow, structure and materials to collect technical data for customer solutions.
Exhibits
For semiconductor front-end wafer manufacturing, assembly and test plants, and ABF substrate plants, Mirle Automation Corporation provides one-stop, stable and fast fully automated material-handling systems intended to meet capacity requirements. For semiconductor assembly and test plants, it provides whole-plant automation services that include factory planning and automation-system integration, supported by its automation-equipment customization experience and after-sales service. The same semiconductor offering is described as helping customers develop unmanned factories within limited production-line space in order to pursue greater operating benefits. Mirle Automation Corporation also describes fan-out panel-level packaging in which semiconductor chips are embedded directly into large-area panels to pursue higher integration, better electrical performance and larger package size. The Equipment Front End Module (EFEM) serves as a loader/unloader in semiconductor plants, supports different wafer sizes and is intended for front-end semiconductor operations. For EFEM implementation, experienced engineers can select a suitable front-end robot, set up the EFEM with the equipment, link communication between SECS/GEM and the host system, and perform BC (Block Control) integration. Its semiconductor intelligent-factory solution list includes Foup Stocker, ZIP Stocker, Auto Guide Vehicle (AGV), Autonomous Mobile Robot (AMR), Conveyor RGV System, Overhead Hoist Transfer (OHT) System, Equipment Front End Module (EFEM) and Lifter. The Automatic Material Handling System product range further lists Clean Room Stocker System, Rail Guided Vehicle (RGV), AGV System, Autonomous Mobile Robot (AMR), EFEM, Overhead Hoist Transport (OHT) System Series, Automatic Storage Retrieval System (AS/RS) and Shuttle Cart. Additional logistics products include Intelligent Logistics Locker, Pallet Type AS/RS and High-speed Intelligent Sortation System, while logistics solutions also include Warehouse Management System (WMS), a high-speed vertical Lifter, and intelligent picking and packing. Its intelligent-control and IoT product set includes MIPC (Mirle IPC), MIPC Control IPC, MS Intelligent Control Computer, DC Servo Drive, SK37D, Intelligent Factory Monitor System and iEC (Intelligent Equipment Cloud). Special-purpose equipment listed by Mirle Automation Corporation includes a High Precision Coating and Laminating System, Optical Glass Molding Press and Vehicle Curved Glass Panel Laminating Process Equipment. AI and digital technology products and services include an Intelligent Two-Phase Immersion Cooling System for AI Servers, Information Security, Big Data Analysis Platform, Predictive Maintenance (PdM), AI Image Platform, Warehouse Management System (WMS) and B2B Supply Chain e-invoice Solutions. For panel manufacturing, the listed solution set also includes FPD Transport System and Vehicle Glass Panel Intelligent Production System, complementing the cleanroom storage and panel-process equipment described for different glass sizes.
Capabilities and products
- fully automated material-handling systems for semiconductor fabs
- semiconductor Equipment Front End Modules (EFEM)
- FOUP stocker systems
- AGV transport systems
- autonomous mobile robots (AMR)
- overhead hoist transport (OHT) systems
- automatic storage and retrieval systems (AS/RS)
- warehouse management systems (WMS)
- two-phase immersion cooling systems for AI servers
- predictive maintenance systems
- high-precision coating and laminating systems
- optical glass molding presses