At a glance
| Booth | P6122 |
| Website | micraftsp.com |
Company profile
Micraft System Plus Co., Ltd. is a Taiwan-based high-technology equipment manufacturer focused on advanced technology, high-technology equipment manufacturing, and production solutions. The company specializes in professional equipment manufacturing, production automation applications, software integration, and technical development, combining these activities as part of its production-solution capabilities. Micraft System Plus Co., Ltd. works in the semiconductor and Mini/Micro LED fields and provides one-stop technical support and equipment integration for these areas. Its current technical development focus includes laser application technologies and their implementation in Mini/MicroLED mass production and semiconductor packaging solutions. The company's combination of automation, software integration, laser applications and equipment manufacturing supports production-oriented implementations rather than a stand-alone component offering. Within semiconductor packaging, Micraft System Plus Co., Ltd. provides equipment integration and production solutions associated with bonding, wafer processing, laser micromachining, laser transfer and sorting operations. Micraft System Plus Co., Ltd. is presented as a provider of professional equipment manufacturing and integrated solutions for Mini/Micro LED mass production and semiconductor packaging, bringing equipment manufacturing and production-solution work into the same company scope. Production automation applications, software integration and technical development are combined with laser application technology as the company develops production implementations for Mini/MicroLED and semiconductor packaging fields.
Exhibits
Micraft System Plus Co., Ltd. presents laser-processing innovations centered on laser application technologies for Mini/MicroLED mass production and advanced semiconductor packaging. For bonding processes, its listed equipment includes thermocompression bonding equipment, laser-assisted bonding equipment, and wafer-to-wafer bonders. For wafer preparation and laser processing, the product range includes wafer slicing equipment and laser micromachining systems. For transfer and assembly operations, the range includes laser transfer systems and bonding equipment. For downstream handling and production organization, the listed range also includes sorting equipment. These equipment categories are presented as integrated production solutions for Mini/Micro LED manufacturing and semiconductor packaging, supported by the company's production automation, software integration and technical-development capabilities. The laser-processing focus covers both mass-production implementation for Mini/MicroLED displays and laser applications used in advanced semiconductor packaging.
Capabilities and products
- laser application technology development
- laser applications for Mini/MicroLED mass production
- laser applications for advanced semiconductor packaging