At a glance
| Booth | Q5130 |
| Country | TW |
| Website | www.kinik.com.tw/en-us/Products/WaferGrindingwheels.html |
Company profile
Kinik Company is a specialized grinding-wheel manufacturer based in Yingge, Taiwan, a place known for ceramics and pottery, and the company states that it has operated for more than seventy years. Kinik Company describes itself as being at the leading edge of its field in technology, production scale, product variety and customer service. The company attributes that position to its service quality and an integrated infrastructure of market channels. Its grinding wheels and cutting tools span basic categories through high-end applications in order to meet a wide range of customer grinding and cutting requirements, with that breadth intended to cover customer needs across both grinding and cutting operations rather than a single process segment. Kinik Company reports that it can provide more than one hundred thousand product specifications and serves more than eight thousand different customers. The company is working to transition toward higher-value-added business by building on its advantages in grinding and cutting. It links sustained capital expenditure and employee training and education with reforming its business organization and extending into diamond-related industries and reclaimed wafers. Kinik Company states that technology development, application innovation and product quality, together with government-grant assistance, have supported its technology-oriented development. Using its artificial-diamond technology, the company says its tooling products for high-end industries improve durability and processing accuracy while substantially reducing the waste of global resources. Kinik Company refers to this artificial-diamond technology and its resource-saving effect as Green Diamond.
Exhibits
Kinik Company provides grinding wheels and cutting tools for applications ranging from basic to advanced precision grinding and cutting processes. Its wafer grinding wheels are used for in-feed grinding of semiconductor wafers including TSV package (Cu/compound), SiC, sapphire, Si and reclaimed wafers. The in-feed process consists of rough and fine grinding, and the wafer grinding wheels use diamond abrasives with a customized vitrified bond in a unique porous microstructure. Diamond sizes are listed as #325 to #1000 for rough grinding and #2000 to #8000 for finish grinding, with product features including a stable high removal rate, long lifetime and lower grinding resistance. A listed fine-grinding example covers 8-inch and 12-inch Si wafers using #4000 and #6000 wafer grinding wheels in-house and at a customer, with Kinik Company reporting longer wheel lifetime through lower tip wear than the competitor in the comparison. For an 8-inch Si example with VW bond and #4000 diamond on DISCO_850, the listed current is 6 to 8 A, tip wear is 0.5 to 2.5 um and roughness is Ra 0.023 um. For an 8-inch Si example with VW bond and #6000 diamond on DISCO_850, the listed current is 7 to 9 A, tip wear is 0.5 to 2 um and roughness is Ra 0.010 um. For a 12-inch Si example with VW bond and #4000 diamond on DISCO_8560, the listed current is 7 to 9 A, tip wear is 0.5 to 2 um and roughness is Ra 0.022 um. In the listed Exxxxx-N2 comparison on DISCO_840 at 5 to 6 A, Kinik Company's tip wear is 0.3 um versus 0.9 um for the competitor, while both listed roughness values are Ra 0.01 um.
Capabilities and products
- precision grinding wheel manufacturing
- precision cutting tools supply
- in-feed grinding wheels for semiconductor wafers
- wafer grinding wheels for TSV/SiC/sapphire/Si wafers