At a glance
| Booth | L1007 |
| Country | TW |
| Website | www.kanematsu.com.tw/news.aspx?n_id=28 |
Company profile
Kanematsu Taiwan Corp. is the Taiwan entity of the Kanematsu trading group and operates from Taipei through multiple business departments serving industrial and technology markets. Its listed departments include advanced materials, optronics products, semiconductor equipment, steel and materials, and foods and grain, combining electronics-related businesses with broader trading functions. Kanematsu Taiwan Corp. states that it has accumulated decades of trading experience in Taiwan and combines that track record with its own global supply chain to strengthen its trading functions. The company says it has established a system to respond closely to the varied needs of customers and partners and to provide solutions suited to those needs. Its Advanced Materials Department and Semiconductor Equipment Department form part of a wider organization that also includes optronics, steel and materials, and food operations. The company’s materials and equipment structure links the Advanced Materials Department, which lists wiring-board and semiconductor-related materials, with the Semiconductor Equipment Department, which lists semiconductor, FPD, and electronic-component or PCB-related equipment.
Exhibits
Kanematsu Taiwan Corp. supplies high-function electronic materials, manufacturing equipment, and analytical instruments used broadly in semiconductor-manufacturing and substrate-manufacturing processes. Its semiconductor-equipment business provides manufacturing and inspection equipment for semiconductors and FPDs made in Japan, Taiwan, and Korea, together with related parts and materials. The company states that it actively develops advanced technologies, broadens its product lineup, and works with Taiwan companies to provide product and service support. Listed offering categories include wiring-board materials, semiconductor-related materials, semiconductor-related equipment, FPD-related equipment, and equipment for electronic components and PCBs. The company centers much of its Taiwan-market introduction work on innovative products and technologies developed by Japanese manufacturers and provides one-stop support from initial introduction through actual use. Specific listed technologies and products include cyanide-free Au plating technology for compound semiconductors, an abrasive-tape wafer-edge polishing machine, and diamond-composite heat-dissipation materials. These offerings sit within a supply scope that links semiconductor and FPD manufacturing and inspection equipment, related components and materials, high-function electronic materials, manufacturing equipment, and analytical instruments. Sourcing from Japan, Taiwan, and Korea is specifically identified for semiconductor and FPD manufacturing and inspection equipment, linking regional equipment supply with product and service support in Taiwan.
Capabilities and products
- cyanide-free Au plating technology supply for compound semiconductors
- abrasive-tape wafer-edge polishing machine supply
- diamond-composite heat-dissipation material supply
- semiconductor and FPD manufacturing/inspection equipment supply
- high-function electronic materials and analytical instruments supply
- one-stop support from equipment introduction through operation