Jong Shiann Enterprise Co., Ltd.

Exhibitor at SEMICON Taiwan 2026 · Booth K3270

Booth K3270Country TW8 product topics
Show facts

At a glance

BoothK3270
CountryTW
Websitewww.jsecl.com
Exhibitor profile

Company profile

Jong Shiann Enterprise Co., Ltd. was launched in 1993 and serves customers in semiconductor manufacturing, wafer fabrication, packaging, smart-card manufacturing, PCB assembly, and testing with equipment, instruments, components, and metal devices. The company also states that it was established in August 1993 and provides hardware equipment parts, materials, and process-upgrade solutions for the electronics and semiconductor industries. Based on its semiconductor packaging and testing experience, the company provides spare parts, materials, hand tools, and measuring instruments for semiconductor assembly equipment and LED manufacturers. It also refurbishes, buys, and sells pre-owned semiconductor assembly equipment, and it regularly maintains stocks of popular second-hand equipment to respond to customer production needs. Its engineering work extends to semiconductor-related equipment improvement proposals, equipment updates, and process planning based on the company's engineering capabilities and production experience. Service capabilities include on-site troubleshooting, circuit-board exchange, and board repair, complementing equipment and spare-parts supply with maintenance support. For LED manufacturing, the company has expanded into high-end LED packaging processes and supplies related production equipment for Mini LED and Micro LED applications. The company also provides AI automation planning and proposals in response to customer goals for unmanned factories. Jong Shiann states that it has built a professional sales and service network and that its customers' finished goods are exported to Southeast Asia, China, Europe, and other markets. Its operating approach emphasizes sustainable management and customer satisfaction while combining semiconductor equipment experience, stocked equipment, engineering support, repair services, and automation proposals.

Exhibitor profile

Exhibits

The equipment-parts catalog covers brands and equipment families including ASM, Lintec, BESI, DISCO, ACCRETECH (TSK), NITTO, DAGE, TEPLA, ADVANTEST, YOKOGAWA, KNS, OKAMOTO, ALPHASEM, ESEC, MULTITEST, SHINKAWA, KAIJO, RENESAS, HP, SEIKO EPSON, FICO, LAURIER, and DATACON. DISCO-related items include DAD 2H5/2H6/2H6T equipment parts and PCBs, DISCO improvement items, BELLOW waterproof curtains, chuck-table repair, sliding doors, blow nozzles, ionizer alarms, coating, and filter silencers. Named parts include a DISCO monitor touch screen, TSK pneumatic cylinder CR080W10X5-D, DISCO 8 INCH UNIVERSAL CHUCK TABLE, TSK VME 162PA 252SE MOTHER BOARD, and TSK LORDPORT LOADER CONNECTOR BOARD HA1147B. The catalog also lists KNS AIS-640/266, an ESEC MAXON MOTOR WITH ENCODER, POWER PS-150, TSK COGNEX 4200 VPM-4214-01, DVE-530 PCB, pneumatic valves, HP 5517B LASER HEAD, BESI ESEC CAMERA, and TSK ADVME 7507A. The spare-parts page indicates a catalog of 1980 entries, reflecting a broad inventory of equipment components and repair-related items for semiconductor and electronics production equipment. HOSON Planar High-speed Die Bonder HAD2610 is listed in the HOSON semiconductor series, alongside product categories that include MINI LED SERIES, LED SERIES, and SEMICONDUCTOR SERIES. HOSON Plane-type High-speed Die Bonder GTS-100AH-PA is listed in the HOSON LED SERIES as another named die-bonding product. The same product pages group additional offerings under CDS rubber tips, needles, Seamark X-Ray Inspection Series, BGA Ball Remove and Reball Series, HJX Laser Saw, and HJX Laser Repair. Across the electronics and semiconductor business, the company provides and supports hardware equipment parts, materials, and process-upgrade solutions rather than limiting its offering to complete machines. Its semiconductor assembly support also includes spare parts, materials, hand tools, measuring instruments, pre-owned equipment refurbishment and trading, equipment improvements, equipment updates, on-site troubleshooting, circuit-board exchange, and board repair. For production development, the available scope includes high-end LED packaging support, Mini LED and Micro LED production equipment, and AI automation proposals for customers pursuing unmanned-factory objectives.

Exhibitor profile

Capabilities and products

Topic group

Related product topics

On this site