基本資料
| 攤位 | K3270 |
| 國別 | TW |
| 產品分類 | Backgrind; Slicing; Lapping; Polishing Equipment · Die Sorter; Pick & Place; Flip Chip Placement Systems · Dispensing Systems · Solder Reflow; Soldering & Brazing Equipment · Tape Automated Bonding (TAB); Bumped Tape Automated Bonding (BTAB) Equipment · Wafer Level Bonders · Wafer Mount; Taping Equipment · Wire Bonding Equipment · Dicing; Sawing; Scribing; Separation Equipment · Die Bonding; Attach Equipment · Cleaning; Washing Equipment for Assembly & Packaging · Base Loader Systems · Die Inspection; Die Shear · Microscopes: Atomic Force Microscopes (AFM) · Microscopes: Confocal Scanning Microscope; 3-D Video Microscopes · Microscopes: Optical Microscopes · Wire Bonding Inspection; Test · Handlers; Positioner Systems · Logic Test Systems · Memory Test Systems · Probing Equipment incl. Analytical; Circuit; Manual; E-Beam; Optical; Wafer Probers · Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools · Cleaning Chemicals; Solvents; Strippers · Bearings; Shaft Collars · Chucks for Wafer and other Substrates · Computer Accessories; Peripherals; Upgrades; Service · Connectors; Plugs; Interconnects; Cable; Wire · Electronic Hardware; Fixtures and Supplies · Fasteners; General Hardware · Filters for Liquid; Oil · Filters, Getters, Purifiers, Catalysts for Gases · Flow Control Components - Valves; Meters; Gauges; Regulators; MFC's · Gaskets; Seals; O rings; Elastomers; Resins · Heating elements; coils; insulation; vestibule blocks and other Furnace components · Indicator Status Lights · Lamps (non Lithography), all type UV; LED and other · Motors; Fans; Electric Rotary Spindles · Sensors · Pumps, for Fluids · Pumps, Vacuum · Temperature Sensing; Control; Recirculators; Chillers; Heat Exchangers · Measurement; Inspection Service · Repair; Rebuild; Install Equipment; Maintenance Services; Spare Parts · Sawing; Lapping; Grinding; Polishing Service · Used; Rental Equipment; Inventory Reduction, Appraisal - Brokers; Resellers · Assembly · Sales; Manufacturers Representation or Distributors |
| 網站 | www.jsecl.com |
公司簡介
仲翔企業股份有限公司成立於 1993 年，主要為半導體、晶圓製造、封裝、智慧卡製造、PCB 組裝與測試領域的客戶提供各式設備、儀器、零組件與金屬元件。仲翔同時協助客戶將成品出口至東南亞、中國、歐洲等地。憑藉專業的業務與服務團隊網絡，我們在業界客戶間建立了優良的企業文化與完美的聲譽。
展出產品
仲信企業成立於 1993 年 8 月，提供電子產業及半導體業相關設備的硬體零組件、材料及製程提升解決方案。
能力與產品項目
- 二手半導體封裝設備翻新
- 二手半導體封裝設備買賣服務
- 半導體封裝耗材與材料
- 半導體封裝設備用手工具
- 半導體封裝設備用量測儀器
- 半導體封裝設備零備件
- 半導體設備改善提案
- 機台到場維修服務
- 電路板交換修理服務