At a glance
| Booth | L1100 |
| Country | TW |
| Website | www.jel-automation.com |
Company profile
JEL AUTOMATION CO., LTD. was founded in 2023 and is headquartered in Hsinchu, having originated from the Taiwan branch of JEL Corporation (Japan) while carrying forward the technical expertise and quality-oriented culture of the Japanese organization. In wafer-semiconductor manufacturing and Panel Level Packaging (PLP), JEL AUTOMATION CO., LTD. focuses on automation where equipment stability is tied to manufacturing competitiveness and process precision. The company is JEL CORPORATION's sole directly invested agency and technical service partner in Taiwan and provides a technical-support system connected with the manufacturer from product selection and system integration through process application and after-sales maintenance. It combines Japanese engineering discipline and quality management with rapid, flexible local support in Taiwan, providing real-time production assistance intended to improve equipment uptime, stabilize process quality, and reduce operational risk. With direct authorization, long-term technical support, a professional engineering team, and field experience in semiconductor and flat-panel industries, JEL AUTOMATION CO., LTD. positions itself as a bridge between JEL CORPORATION and Taiwan's high-tech manufacturing sector. Through JEL CORPORATION's technical support, the company connects manufacturing and technical resources across regions of Japan and Changzhou, China, for smart-manufacturing environments serving semiconductor and other high-tech manufacturers. Its semiconductor wafer-handling offering includes cylindrical-coordinate robot arms with cost advantages and straight travel paths, horizontal multi-joint robot arms with flexible paths and high stability, precision wafer aligners and related components, and customized design, assembly, and professional OEM services for EFEM and Wafer Sorter systems. JEL AUTOMATION CO., LTD. also provides after-sales service and customized proposals as an official JEL product agent, with its service approach centered on the customer's production requirements. JEL CORPORATION has specialized in semiconductor-handling robotics since 1993, and JEL AUTOMATION CO., LTD. brings its 100% Japan-made production, flexible R&D resources, customization capability, and system-integration expertise for different clean-environment requirements into Taiwan's semiconductor industry.
Exhibits
For semiconductor and panel automation, JEL AUTOMATION CO., LTD. provides high-precision Wafer Robot, EFEM, and Sorter equipment and combines the manufacturer's design base and application experience with customized development for process-efficiency and cost requirements. Its semiconductor robot lineup includes SCR3100S, SCR3130CS, and SCR3160CS 3-Axis Cylindrical Coordinate Clean Robots, plus SCR3160CSN as a 3-Axis Cylindrical Coordinate Closed-loop control Clean Robot. The lineup also includes STCR4130S, STCR4160S, and STCR4160SN 4-Axis Cylindrical Coordinate Clean Robots; STVCR4160 and STVCR4190 4-Axis Cylindrical Coordinate Vacuum Compatible Clean Robots; STWCR4160 as a 4-Axis Cylindrical Coordinate Waterproof Clean Robot; and SVCR3160 and SVCR3190 as 3-Axis Cylindrical Coordinate Vacuum Compatible Clean Robots. The SCR3100S is a stepping-motor 3-Axis Cylindrical Coordinate Clean Robot designed for handling small wafers in semiconductor production or inspection lines, with a minimized footprint intended to compact the system layout. Its listed environment is an ISO Class 2 clean-room atmosphere, available Z-axis vertical strokes are 200 mm, 300 mm, and 500 mm, payload capacity is below 0.5 kg calculated for the third joint, and the design can be modified according to equipment specifications and requirements. SCR3100S can use base or flange mounting, provides motion monitoring, uses RS232C and parallel photo I/O as standard control interfaces, installs 2-phase stepping motors on all axes, and uses S-curved speed control for high-speed, high-accuracy wafer handling. Wafer holding can use vacuum-suction, passive-edge, or edge-grip end-effectors, while end-effector materials can be CFRP, Al, ceramic, or other materials selected according to the carried object and line layout. For the SCR3100S-200-PM standard specification, the handled object is up to a 6-inch wafer, the wrist block is SARS00169, the blade is 3D-02535, the mechanical structure is a 3-axis cylindrical-coordinate type, and the motor is a stepping motor. The listed operating range for SCR3100S-200-PM is 397.7mm from the robot center to the wafer center, a 340deg rotation angle on the θ axis, and a 200mm Z-axis vertical stroke. Average carrying speeds are 330mm/sec for the R-axis arm, 280deg/sec for θ-axis rotation, and 130mm/sec for Z-axis travel, while maximum speeds are 500mm/sec, 480deg/sec, and 170mm/sec respectively. Repeatability is listed within ±0.1mm, cleanliness as ISO Class 2 at wafer-transfer level when the driving part is exhausted, power as DC24V±10% 8A, vacuum as -53kPa or more, and the controller as the C4000 series with RS232C and parallel photo I/O. The broader offering also includes precision wafer aligners, related components, and customized EFEM and Wafer Sorter design, assembly, and OEM services.
Capabilities and products
- cylindrical-coordinate wafer handling robots
- horizontal multi-joint wafer handling robots
- precision wafer aligners and parts
- custom EFEM design, assembly, and OEM services
- custom Wafer Sorter design, assembly, and OEM services
- semiconductor automation system integration and process application