At a glance
| Booth | I3000 |
| Country | GB |
| Website | www.infiniflux.cool |
Company profile
Infiniflux is a deep tech startup developing advanced 2-phase Direct-to-Die Liquid Cooling technologies for the most powerful 2.5D and 3D chips used in AI and HPC data centres. Infiniflux’s technology provides advanced heat removal, targeting hotspots on processor dies to eliminate heat spikes, enhance compute capacity, and extend device lifespan. This breakthrough supports next-generation chips with higher densities and duty cycles. The superior cooling performance is based on a patent-pending cold plate design with 75% lower thermal resistance and a unique system architecture that requires much less pump energy. The system removes significantly more heat than single-phase liquid cooling, uses less energy and requires virtually no maintenance. The technology is suitable for both new build data centres and retrofits. Infiniflux has secured equity investment from Zinc VC and grant funding from Innovate UK, the Royce and the Grantham Institutes, ensuring strong foundations for growth. The company recently won the IC Taiwan Grand Challenge award, showcased at Innovex/Computex, and is experiencing significant interest from leading semiconductor and compute ecosystem players in Taiwan and the wider Asian region. Joint feasibility studies with advanced packaging companies for integration of Infiniflux’s cold lid technology, Partnerships with MEMS foundries for silicon cold lid production, Joint feasibility studies with server OEMs/ODMs to integrate 2-phase cooling loop in servers, Component manufacturers for cooling loop parts, Server rack manufacturers and system integrators, Pilot projects with data centres using advanced liquid cooling, and Collaboration with academic institutions in liquid cooling, thermo-hydraulics and IC packaging.
Exhibits
Develops advanced two-phase direct-to-die liquid-cooling technology for high-power 2.5D/3D AI and HPC chips, based on a patent-pending cold plate and low-pump-energy system architecture. Capabilities include cold-lid integration and two-phase cooling loops for new-build and retrofit data centers.
Capabilities and products
- 2-phase Direct-to-Die Liquid Cooling technologies
- cooling for 2.5D and 3D chips in AI and HPC data centres
- cold plate design with 75% lower thermal resistance
- targeting hotspots to eliminate heat spikes and extend device lifespan
- unique system architecture requiring much less pump energy
- suitable for both new build data centres and retrofits
- won the IC Taiwan Grand Challenge award
- partnerships with MEMS foundries for silicon cold lid production