At a glance
| Booth | Q6235 |
| Country | JP |
| Website | ibarakiseito.com |
Company profile
IBARAKI GRINDING WHEEL Co., Ltd. / 株式会社茨城製砥 is a specialized manufacturer of precision grinding tools, including resinoid ultrathin cut-off wheels, diamond and CBN electroplated tools, and patented wire-mesh grinding wheels. 株式会社茨城製砥 was established in February 1968 and began manufacturing ultrathin cut-off wheels at the time of establishment. The company began manufacturing electroplated grinding wheels in April 1983 and reorganized as 株式会社茨城製砥 in November 1997 with capital of 10,000,000 yen. It completed a second factory in Joso City, Ibaraki Prefecture in May 2007 and obtained ISO9001 quality-management-system certification in February 2016. The company marked its 50th anniversary in February 2018, relocated and completed its first factory in Joso City in September 2024, and began manufacturing wire-mesh grinding wheels in August 2025. Its stated workforce was 31 employees as of August 2025. Manufacturing and inspection equipment listed for ultrathin cut-off wheels includes electric firing furnaces, vertical and cylindrical grinding machines, marking equipment, a Keyence GT2 contact digital sensor, a Struers Secotom-60 precision cutting machine, and a rotation tester. Electroplated-tool facilities include diamond/CBN electroplating equipment, masking and finishing equipment, a Vision Engineering Lynx eyepiece-less stereo microscope, Keyence VHX-X1 digital microscope, Keyence MD-X2000 hybrid laser marker, and Keyence IM-8000 image-dimension measurement system. Machining facilities include multiple CNC lathes and automatic lathes, a CNC milling machine, small-hole EDM equipment, cylindrical grinding machines, and a Mitutoyo PJ-A3000 projector.
Exhibits
The company manufactures resinoid ultrathin cut-off wheels with thicknesses from 0.1mm to 3.0mm using its own special manufacturing method. The ultrathin cut-off wheels are described as having high thickness accuracy and sharp cutting action for efficient cutting, while the thin wheel reduces workpiece loss and cutting cost. They are designed for precise and tough machining in both wet and dry conditions, with general abrasives and superabrasives (SD/CBN) available according to the application. Wheel selection is based on abrasive type, grit size, grade, and dimensions, and the company states that suitable selection improves machining accuracy and efficiency. The ultrathin-wheel range supports outer diameters up to 405mm and thicknesses from the minimum 0.1mm to 3.0mm. Diamond & CBN Electroplated Tools fix diamond or CBN superabrasive grains in a single layer onto a metal base by nickel electroplating. Their high abrasive-grain concentration and large grain protrusion provide sharp cutting action and efficient material removal for hard and brittle materials such as ceramics and cemented carbide as well as difficult-to-cut hardened ferrous materials. Because the abrasive is electroplated precisely to the metal base, the tools can be manufactured accurately in complex shapes and can be freely shaped for applications starting from small lots. When abrasive grains are worn but the metal base is undamaged, the electroplated surface can be stripped and replated, allowing reuse of the base for shorter lead time, lower cost, and tool accuracy close to a new tool. The electroplated tools use synthetic diamond and CBN; synthetic diamond is described as an artificially made diamond with very high hardness, while CBN is cubic boron nitride with hardness next to diamond, greater heat resistance, and lower reactivity with iron. Those CBN properties are stated as suitable not only for difficult-to-cut materials but also for high-speed grinding of ferrous metal materials. The patented wire-mesh grinding wheel electroplates diamond onto a wire mesh or an ultra-thin base metal and uses high chip-evacuation performance for high-efficiency, high-quality, low-cost machining of difficult-to-cut materials. For CFRP, the diamond grains shear the carbon fibers finely, described as cutting through them as if shaving, rather than merely removing bulk material without a stated mechanism. For brittle materials such as alumina and optical glass, the diamond grains remove stock in fine increments. By those stated cutting mechanisms, the wire-mesh grinding wheel suppresses burrs, delamination, and chipping and produces a high-quality finish on the identified difficult-to-cut materials. The combined product portfolio therefore includes resinoid ultrathin cut-off wheels, diamond/CBN electroplated tools, and wire-mesh grinding wheels for precision cutting and grinding, with explicit support for difficult-to-cut material machining.
Capabilities and products
- 0.1–3.0 mm resinoid ultrathin cut-off wheels
- diamond electroplated tools
- CBN electroplated tools
- diamond wire-mesh grinding wheels
- precision grinding wheels for brittle materials