At a glance
| Booth | I2300 |
| Country | TW |
| Website | www.hyetech.com.tw |
Company profile
HYE TECHNOLOGY CO.,LTD. was founded in 2014 and centers its business on the sales and manufacturing of self-developed automation equipment. The company identifies customization and its R&D team as core strengths and provides automation equipment with intelligent-inspection functions for semiconductor and optoelectronics industries. Its primary sales base is customers listed on Taiwan’s stock markets, with customers in Japan and mainland China also included in its market coverage. HYE has office locations in Taipei, Hsinchu, Tainan, Kaohsiung, Suzhou, and Shenzhen. The company states that it completed an OTC IPO in June 2023 and that its operating headquarters is located in the Luzhu site of the Southern Taiwan Science Park. Its main capabilities include planning full-automatic and semi-automatic inspection and measurement systems, automation-equipment planning, AOI/AVI machine-vision planning, and semiconductor quality inspection. The company also explicitly states that it has developed semiconductor wafer AOI inspection equipment and semiconductor automation equipment. Application areas listed by HYE include automated packaging and testing, wafer manufacturing, optoelectronics, PCB, and smart manufacturing, and the company also provides ODM and OEM services. The stated business therefore combines self-developed automation-equipment manufacturing with customized development, intelligent inspection, system planning, machine vision, semiconductor quality inspection, and ODM/OEM support.
Exhibits
HYE lists Leopard-9000 2D+3D Inspection System, Leopard-7000 Auto OM macro and micro inspection system, and Leopard-5000 Carrier wafer macro inspection system among its products. Leopard-9000 is a wafer micro-inspection system for post-wafer-fabrication inspection targeting particles, contamination, scratches, chipping, RDL defects, BD/BH/COP, and circuit anomalies. The system integrates a multi-magnification optical review microscope for high-resolution defect verification. Leopard-9000 is compatible with 8-inch and 12-inch wafers and includes ultra-high-resolution 3D bump metrology and inspection capability. The listed target industry for the system is Semiconductor (SEMI). Optional features include 3D Metrology and HPL (High-Performance/High-Precision Line) Inspection. The product page places the system in the company’s automated packaging and testing and wafer micro-inspection offering, while also listing optoelectronic, PCB, smart-manufacturing, and ODM&OEM categories. Together with the company’s full/semi-automatic inspection and measurement system planning, automation-equipment planning, AOI/AVI machine-vision planning, and semiconductor quality-inspection work, the Leopard products form part of HYE’s semiconductor intelligent-inspection automation offering.
Capabilities and products
- self-developed automation equipment manufacturing
- full/semi-automatic inspection and measurement system planning
- automation equipment planning
- AOI/AVI machine-vision planning
- semiconductor quality inspection
- semiconductor wafer AOI inspection equipment
- semiconductor automation equipment
- 2D+3D wafer micro inspection
- 3D bump metrology and inspection
- ODM/OEM services