At a glance
| Booth | M0356 |
| Country | TW |
| Website | www.hwashu.com.tw |
Company profile
HWASHU Enterprise Co., Ltd. was founded in 1982 and specializes in precision mold fabrication and plastic injection molding. In its early years, the company focused on the design and production of diverse consumer plastic-injection molds and plastic products. After developing IC Tray and beginning mass production in 1992, HWASHU entered the packaging-material supply chain for the semiconductor packaging and testing industry. The company established an Embossed Carrier Tape production line in 1998, and its Tape & Reel products subsequently received recognition from major domestic and overseas IC packaging and testing plants. In 2003, HWASHU developed Chip Tray production and formed a broader product portfolio for IC carrier packaging. Its customer distribution covers Taiwan, China, Japan, Korea, Singapore, Malaysia, Philippine, and Thailand, and the company has service offices in Singapore and Japan. The company profile states that HWASHU supplies IC Tray, Tape & Reel, and Chip Tray as a complete IC carrier-packaging product line and also identifies Heat spreader among the products in its stated vision. Across this development history, precision mold fabrication, plastic injection molding, IC-tray development and manufacturing, embossed-carrier-tape production, Tape & Reel products, and Chip Tray production are all explicit parts of the company’s business.
Exhibits
HWASHU has developed and manufactured IC Tray and Tape & Reel products for the semiconductor packaging and testing industry for nearly 20 years, with major customers described as large global semiconductor packaging and testing manufacturers. IC Tray and Tape & Reel are used to carry, protect, and transport ICs or electronic components and to enable accurate operation on related equipment. For IC Tray in particular, product and mold design, simulation, and precise production-condition control are used because the tray must resist deformation during high-temperature baking together with the IC. HWASHU states that it has thousands of molds across IC Tray, Chip Tray, and Embossed Carrier Tape and continues to develop new designs and molds each year for different package types and new specification requirements. For shorter new-product development schedules, the company combines integrated product design, standardized mold design and manufacturing, and high-speed precision CNC machining and production. Its IC Tray portfolio is supported by more than 1,000 IC Tray molds for different package types and sizes, and the trays are designed in accordance with JEDEC standards for IC carrying and protection. IC Tray material options include MPPE, MPPE+Glass fiber, MPPE+Carbon fiber, PES, PS, and ABS, with stated maximum baking temperatures of 180/150/135 ºC and surface resistivity of 1x105~1x1012 ohms/square. IC Tray package types include BGA, TFBGA, FCBGA, QFN, QFP, LQFP, TQFP, TSOP, SOP, SIP, and CIS. End-cap and Clip-tab options provide special identification for classifying different IC test BINs, with multiple color and printing choices; the Chinese product description also states that these can withstand high-temperature baking. The Chip Tray and COG Tray range uses more than 400 Chip Tray molds, covering general-purpose Chip Tray and COG Tray dedicated to LCD drivers in 2-inch, 3-inch, and 4-inch sizes using anti-static ABS. For COG Tray flatness, HWASHU applies mold-flow analysis during product and mold design together with material-property considerations, mold-structure development, and injection-molding-condition control. The Embossed Carrier Tape range is supported by more than 600 Carrier Tape molds and is designed in accordance with EIA standards for IC carrying and protection. Carrier Tape applications cover semiconductor IC, WLCSP, Discrete, Optical devices, LED, and other electronic components, with primary tape widths of 8, 12, 16, 24, 32, 44, 56, and 72 mm and anti-static PS and PC materials. Carrier Tape types include QFP, LQFP, TQFP, BGA, TFBGA, FCBGA, QFN, TSOP, SOP, SOT, TO, SIP, CIS, and LED. Cover Tape widths include 5.4 / 5.5 / 9.2 / 9.3 / 9.5 / 13.3 / 21.3 / 25.5 / 37.5 / 49.5 / 65.5 mm, using anti-static material in heat-sealing and self-adhesive types, with full sealing or peeling and reliability tests to meet customer specifications. Reel specifications include 13” (330 mm) diameter with 8, 12, 16, 24, 32, 44, and 56 mm hub widths, 4" and 7" hub diameters, and PS material in blue, white, or black; 7” (178 mm) reels are listed with 8 and 12 mm hub widths in the same PS color options. Protective Band is listed for Carrier Tape widths of 8, 12, 16, 24, 32, 44, 56, and 72 mm. For precision plastic injection molding, HWASHU plans mold design around required product accuracy, material characteristics, shrinkage rate, and mold-flow analysis, then controls injection conditions and verifies dimensions using 2D and 3D image-measurement instruments. Its precision mold and jig operation draws on 30 years of precision-mold R&D and manufacturing experience and uses ultra-high-speed CNC machining centers, precision CNC wire-cut equipment, precision EDM equipment, and conventional milling and grinding machines. The mold department also develops metal jigs for customer production processes, extending the company’s stated capabilities from IC carrier packages into precision injection products and production-process tooling. Taken together, the supplied product families cover IC Tray, Chip Tray & COG Tray, Tape & Reel, precise plastic injection, and precision molding jigs, supported by mold design and development, integrated mold manufacturing, and high-speed precision CNC machining.
Capabilities and products
- IC Tray manufacturing
- Chip Tray manufacturing
- COG Tray supply
- Embossed Carrier Tape manufacturing
- Cover Tape supply
- Reel supply
- Protective Band supply
- End-cap & Clip-tab supply
- precision plastic injection molding
- precision mold R&D and manufacturing
- metal production-process jig development