基本資料
| 攤位 | L0306 |
| 國別 | JP |
| 產品分類 | Backgrind; Slicing; Lapping; Polishing Equipment · Cleaning; Washing Equipment for Assembly & Packaging · Cut & Down Set; Trim; Form Equipment · Dicing; Sawing; Scribing; Separation Equipment · Die Bonding; Attach Equipment · Die Removal Equipment · Die Sorter; Pick & Place; Flip Chip Placement Systems · Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners · Tape Automated Bonding (TAB); Bumped Tape Automated Bonding (BTAB) Equipment · Wafer Level Bonders · Wafer Mount; Taping Equipment · Wire Bonding Equipment · Alignment Film Coating Equipment · Laser Treatment; Cutting Systems for Panels & Photocells · Liquid Crystal Injection or Filling Equipment · Cutting; Drilling; Laser ablation; Beveling Equipment · Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating · Lamination; Sheet Laminating Equipment · Repair; Rework Equipment · Sealing; Bagging; Packing Equipment · Space simulation; Vacuum chambers · Acoustic Spectroscopy; Electron Spectroscopy for Chemical Analysis (ESCA); Ultrasonic; Acoustical Mi · Defect; Particle; Bump; Contamination Detection, Review or Inspection · Film Thickness; Thickness; Uniformity Measurement; Ellipsometer · Line Width; Critical Dimension (CD) Measurement · Microscopes: Optical Microscopes · Microscopes: Scanning Electron Microscope (SEM); Focused Ion Beam (FIB), Transmission Electron Micr · Overlay Measurement · Wire Bonding Inspection; Test · Deep RIE etching; Dry Etching · Double sided mask aligner · Cells · Coat; Develop; Resist Processing; Track Equipment · Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD · Etching; Stripping; Ashing - Dry and Wet Equipment · Ion Implantation Equipment · Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint · Memory Test Systems · Optical Test Systems · Package Test Systems · Probing Equipment incl. Analytical; Circuit; Manual; E-Beam; Optical; Wafer Probers · Power Supplies; RF Generators; Converters; Electrical Conditioning · Pumps, for Fluids · Stand-Alone Systems · Repair; Rebuild; Install Equipment; Maintenance Services; Spare Parts · Used; Rental Equipment; Inventory Reduction, Appraisal - Brokers; Resellers · Equipment; Hardware; Product Design, Integration and Manufacturing |
| 網站 | www.hightec-sys.com |
公司簡介
Hightec Systems Corporation 是一家半導體與 FPD 製造設備買賣及工程服務公司。其官方英文網站指出，Hightec Systems 專門從事半導體與 FPD 製造設備，並擁有從較新先進設備到較舊設備的庫存。網站列出的服務包括中古半導體與 FPD 製造設備買賣、半導體/FPD 生產線搬遷與翻新、海外製造的新 MEMS 製造或研發設備銷售與技術支援，以及中古零組件與輔助設備買賣。官方中文版本也補充，該公司活躍於日本與上海，並提供生產線搬遷等綜合技術工程。台灣公司登記資料則確認日商先端科技系統股份有限公司台灣分公司為 Hightec Systems Corporation Taiwan Branch。可取得來源顯示，其商業模式以設備再利用、翻新、技術支援與產線搬遷為核心。
能力與產品項目
- die bonding 與 attach 設備供應
- 二手半導體與 FPD 製造設備供應
- 二手零件與輔助設備供應
- 切割、鋸切、劃線與分離設備供應
- 半導體/FPD 生產線搬遷與翻修
- 新 MEMS 製造與 R&D 設備支援
- 生產線轉移技術工程
- 組裝與封裝清洗設備供應
- 背磨、切片、研磨與拋光設備供應