At a glance
| Booth | Q5338 |
| Country | TW |
| Website | www.hilosystems.com |
Company profile
Hi-Lo System Research Co. Ltd is a global provider of IC programming, IC testing, and IC optical inspection (3D) solutions. Since 1983, the company has focused on comprehensive IC programming and wire/die bond vision solutions intended to meet capacity and quality requirements. Its products have been distributed worldwide, and the company reports a significant market share in the semiconductor industry. Hi-Lo System Research Co. Ltd combines international distributorship with overseas offices and technical support to serve customers around the world. Its R&D work emphasizes self-reliant technology and in-house system capacity, with products and services spanning engineering device programmers, production device programmers, and automated systems. The company describes long-term customer relationships ranging from world-leading EMS companies to major automotive-electronics manufacturers and reports more than 50% market share over a period exceeding 35 years. Its programming-service network covers 20 different cities across the Americas, Europe, and Asia, while annual equipment sales include more than 50 automated systems and tens of device programmers. Hi-Lo System Research Co. Ltd develops programming technology around IoT devices, connected and self-driving cars, 5G applications, and UFS, and it has designed a special automated model for automotive MCU programming.
Exhibits
Hi-Lo System Research Co. Ltd established its first programming center in 2001, extending its expertise into IC programming services for demand from the IT and hand-held device markets. With engineering-team support and more than 200 automated programming systems installed, its programming centers provide device programming, ink and laser marking, taping and reeling, 3D optical lead inspection, baking, dry packing, customized device programming, and customized packing. More than 50 AT3-300 Series automated systems provide greater than 500K daily capacity for Tray, Tube, and Tape IC programming, with process and operation controls used to manage service quality and yield. Dry packing is available for Tray devices and Tape & Reel packages. The programming center is ISO 9001 and ISO 14001 certified, uses an ERP real-time management-control system for programming processes and operations, and can provide programming services for more than 300K units per day. Hi-Lo System Research Co. Ltd develops the HiLoSQ secure platform and works with other companies on customized solutions intended to protect customer assets against risks associated with IoT and connected technologies. HiLoSQ provides a public/private-key platform for protecting files during transmission against hacking. Customized secure offerings include special R&D projects, customized support, and secure programming services intended to reduce development vulnerabilities, save costs, and accelerate time to market. Supported device types include UFS, eMMC, eMCP, MCU/MPU, NOR/NAND Flash EEPROM, SPI Memory, FPGA, and CPLD, while supported packages include DIP, SDIP, SOP, SSOP, TSOP, PLCC, QFP, QFN, SON, BGA, and WLCSP. Programming coverage includes major IC brands from the U.S., Japan, Taiwan, and European countries. Ink and laser marking supports alphanumeric marks of up to 4 letters, more than 10 Laser/Auto Markers provide greater than 500K daily marking capacity, and marking colors can be selected according to customer requests. For taping and reeling, the company maintains carrier and cover tapes for a wide variety of packages, performs visual inspection before the process, and can obtain customized carrier tapes for specific requirements. The service scope also includes 3D optical lead inspection for TSOP, BGA, QFN, and QFP packages, baking for data-retention tests, and a pre-baking option before dry packing. The ALL-300G2 Universal Gang Programmer supports eMMC and UFS, uses a USB 3.1 Gen1 (USB3.0) interface, supports up to 16 sockets, and is positioned for small- to medium-volume high-density device programming production. The ALL-300S Engineering Universal Programmer supports eMMC in a palm-size format for engineering development and QC inspection, while the UFS-300S UFS Programmer uses an exclusive UFS programming core in a similarly compact format. The ALL-200G Universal Gang Programmer and ALL-200 Engineering Universal Programmer each support more than 100,000 ICs; the gang model supports up to 8 sockets, and the engineering model is intended for engineering development and QC inspection. ALL-300S includes full IC pin-contact checking to prevent bad socket contact or damage from reversed placement, supports a broad device and package range, and provides a graphical interface that displays functions, device details, and status throughout programming. Software support for ALL-300S includes updates posted weekly on the HI-LO website, fast support by customer request, and immediate follow-up on programming problems. Its new-generation ALL-300S programming core supports the latest IC devices and more than 95% of MCU ICs in the market, and the company states that it provides three times faster eMMC programming than another programmer. For automotive electronics, the AT3-370AL automated programming system incorporates internal 3D quality inspection and is described as a designated and authorized programming solution for most automotive-electronics suppliers. The automotive application context includes microcontrollers and processors for vehicle communication and control as well as high-density eMMC and UFS devices for in-vehicle infotainment, with an EV described as using at least 150 chips. For IoT and smart-city applications, the ALL-300 series programming core targets high-density UFS and eMMC devices, and the company reports programming performance that is on average 400 percent faster than other brands. For consumer-electronics supply chains covering smartphones, laptops, wearable devices, and home automation, the company offers the AT3-310 series automated programming system; it also reports support for more than 100,000 devices and sales of more than 500 equipment sets over time. The UFS-300S supports UFS 2.0, UFS 2.1, UFS 3.0, and UFS 3.1, MIPI M-PHY V3.0, UniPro Specification V1.6, UFS Card Extension V1.0, up to 2 Lane Gear 3 in Rate A or Rate B, and 19.2MHz or 26MHz RCLK frequency. UFS-300S supports UFS LUN read/write plus settings such as Descriptor and Attributes, includes 64G internal memory that is expandable, and supports USB 3.1 Gen1 (USB3.0) download speed up to 280 MB/s. Its stated UFS programming performance reaches program speed up to 230 MB/s and verify speed up to 880 MB/s. The UFS-only programming core supports SOP, TSOP, QFP, BGA, QFN, SON, and WLCSP packages and includes full IC pin-contact checking to reduce bad contact and reversed-placement damage risks. The UFS-300S software interface is graphical and displays programming functions, device details, and status, while support includes customer-requested assistance, weekly software updates, and follow-up on programming problems.
Capabilities and products
- IC programming solutions
- IC testing solutions
- IC 3D optical inspection
- wire/die-bond vision solutions
- over-500K-per-day Tray/Tube/Tape IC programming
- IC ink/laser marking
- IC taping and reeling
- 3D optical lead inspection
- IC baking and dry packing
- secure programming services
- eMMC/UFS universal gang programmer
- eMMC engineering universal programmer
- UFS-only programmer
- automated automotive-electronics programming with 3D inspection