At a glance
| Booth | P5920 |
| Country | TW |
| Product categories | Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners · Cutting; Drilling; Laser ablation; Beveling Equipment · Line Width; Critical Dimension (CD) Measurement · Microscopes: Optical Microscopes · Package Inspection; Lead Scanners · Package Substrates; Laminate; Film based · Packages; Ceramic and Other High Temp Compounds · Printed Circuit Boards (PCB); Printed Wire Boards (PWB) · Printing Masks; Screens · Mask and Reticle Handling Products · CMP; Grind; Lap; Polish; Abrasive materials · Wafer Bumping Service · Circuit Design; Electronic Design Services (EDS); System Level Design (SLD) |
| Website | www.hajime.com.tw |
Company profile
Established in 1990, Hajime Corporation has served as the leading role in bringing the most advanced materials and technologies to the electronic industry. We provide a large variety of products, including materials and equipments for manufacturing PCB and Flexible PCBs (FPC).Hajime Corporation acts as the sale representative for the industrial adhesive tape from Sliontec, PU roller encapsulants for high top paper from Yamauchi, and soft acrylic board from CRD.Currently, the main product sold in Taiwan is UV dicing tape for semi-conductor industries. Also, there are a wide variety of single-/double-side industrial tapes sold in various industries.Hajime Corporation is also the dealer for British company Vision’s inspection equipments marketed to PCB, FPC and SMT semiconductors industry which is used during the production processes. In 2008, we brought newly designed image measuring equipments from self-owned brand Unifocus in order to provide better services to our clients.
Capabilities and products
- PCB and Flexible PCB manufacturing materials and equipment
- UV dicing tape for semiconductor industries
- Unifocus image measuring equipment
- cutting, drilling, laser ablation and beveling equipment
- inspection equipment for PCB, FPC and SMT semiconductor production
- line width and critical dimension measurement
- optical microscopes
- wafer-level packaging lithography and 3D interconnect aligners