Hajime Corporation

Exhibitor at SEMICON Taiwan 2026 · Booth P5920

Booth P5920Country TW8 product topics
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BoothP5920
CountryTW
Websitewww.hajime.com.tw
Exhibitor profile

Company profile

Hajime Corporation was established in May 1990 and describes its role as bringing advanced materials and technologies to the electronics industry, with a broad offering that includes materials and equipment used to manufacture PCBs and flexible PCBs (FPC). The company's headquarters is in the Neihu Technology Park, while a technical center and warehousing and logistics center operate in the Wugu Industrial Park; overseas development includes a Tokyo branch in Japan and an office in Beijing, China. Hajime Corporation has capital of NTD10 million and 40 employees, alongside its Taiwan operating sites and overseas offices. Its sales activities span automation, high-tech electronics, carbon-fiber composites, semiconductors, papermaking and industrial tapes, reflecting a portfolio that serves both electronic production and broader industrial-material markets. Hajime Corporation states that it works with more than 20 partner companies, including NIPPON STEEL Chemical & Material Co., Ltd., Sekisui Chemical Co., Ltd. and Mitsubishi Chemical, as it continues to introduce technologies, equipment and materials for customers. The company acts as a sales representative for Sliontec industrial adhesive tape, Yamauchi PU roller encapsulants for high top paper and CRD soft acrylic board. Its main product sold in Taiwan is UV dicing tape for semiconductor industries, and it also sells a wide variety of single-sided and double-sided industrial tapes into multiple industries. Hajime Corporation is also a dealer for inspection equipment from the British company Vision, with the equipment marketed to PCB, FPC and SMT semiconductor production processes. In 2008, the company introduced newly designed image measuring equipment under its self-owned Unifocus brand to expand the equipment it could provide to clients. Since its establishment in 1990, Hajime Corporation has stated five business philosophies: education, innovation, creation, harmony and trust, and connects those principles with working together toward a mutually beneficial society. In 2025, Hajime Corporation marked its 35th anniversary, following earlier trade-show, product and organizational activities recorded across more than three decades of operation.

Exhibitor profile

Exhibits

The industrial-material offering includes carbon fiber and soft adhesiveless copper-clad laminate (FCCL) using rolled copper, while the industrial materials division also presents carbon fiber, RA copper and two-layer FCCL. For semiconductor and electronic-material applications, the company supplies Maxell UV packaging dicing tape designed for wafers, substrates and glass, extending the UV dicing-tape business identified as a main product in Taiwan. The tape uses PO material stated to comply with European requirements, and the material is described as halogen-free and compliant with RoHS testing. Its substrate is designed for stretchability and isotropy so expansion can be performed without heating, while an easy-peel design is intended to reduce chip residue and damage risk. A thin adhesive design is used to reduce backside chipping, and the substrate and adhesive-layer design is stated to increase workpiece adhesion and reduce the probability of material flying during processing. The special substrate design is also intended to reduce process burrs and adhesive stringing, and UV curing supports easy peeling so unloading and part removal can be performed more easily. The UV dicing tape is stated to accommodate different products and die sizes, including wafers, CSP, BGA, BT Substrate and CMOS glass. Product numbers include 6360-15, 6360-25, 6360-55, 6360-95 and 6362-25, with types identified as standard, high adhesion, easy die pick, high-adhesion easy die pick and antistatic. Additional products and technologies include Resin Eteching, Printing Transfer, a PCB warpage correction System, Pressed Steel Plate, silver nanoparticles, adhesiveless polyimide copper-clad laminate エスパネックス®, and PAN-based carbon fiber.

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