At a glance
| Booth | L1004 |
| Country | TW |
| Website | www.geckostc.com |
Company profile
Geckos Technology Corporation is a technology company in Kaohsiung, Taiwan, also associated with the Geckos Group and 凱鍶科技 brands, and it focuses on oxidation-resistant nano conductive copper paste and copper ink. The company has developed oxidation-resistant nano conductive copper paste and copper ink with stated properties that include oxidation resistance, good electrical conductivity, good adhesion, solderability, and compatibility with electroplating. Geckos Technology Corporation is also developing a high-performance thermal-dissipation paste designed for improved printability, low-temperature sintering, and good heat-dissipation performance. Its material-development model includes customization according to customer requirements, allowing copper-paste formulations and related materials to be adjusted for different application scenarios. The company’s antioxidant conductive copper paste and its preparation method received a Platinum Award at the 2016 Taipei International Invention Show & Technomart. Application areas named for its conductive copper materials include semiconductor WLCSP circuit bumping, repair of broken portions of printed circuit boards (PCB), and RFID electronic tags. For semiconductor-related work, Geckos Technology Corporation also states a focus on polymer-material development and semiconductor-packaging applications, connecting its material R&D with packaging-oriented use cases. Taken together, the company’s stated work covers conductive copper materials for printed electronics, thermal-dissipation needs, electronic-material applications, and semiconductor packaging, with customization used to match different customer applications.
Exhibits
Geckos Technology Corporation supplies oxidation-resistant nano copper paste designed to overcome copper’s tendency to oxidize, with the material retaining stated oxidation resistance even under high-temperature and high-humidity conditions. After appropriate curing, the nano copper paste is described as achieving good electrical conductivity, thermal conductivity, and adhesion, combining electrical, heat-transfer, and bonding properties in the cured material. The company can customize copper paste for different application scenarios as cross-industry uses broaden, making application-specific formulation adjustment part of the stated product approach. A listed specification for Rough Leadframe / PPF gives a Fillet Height requirement of 30~75%, providing a specific numerical requirement associated with the described copper-paste application. The stated material range also includes copper-paste materials and a high-thermal-conductivity conductive mixed copper paste, extending the offering from oxidation-resistant nano-copper formulations to a named heat-conductive mixed-copper-paste category. For semiconductor packaging, the company links its polymer-material development with conductive copper materials, including the high-thermal-conductivity conductive mixed copper paste and its broader work on oxidation-resistant nano-copper materials. Its semiconductor-related application list also includes WLCSP circuit Bumping, while the broader electronics applications include PCB broken-line repair and RFID electronic tags.
Capabilities and products
- anti-oxidation nano conductive copper paste
- anti-oxidation nano conductive copper ink
- application-specific customized copper paste
- high-heat-dissipation conductive mixed copper paste