基本資料
| 攤位 | N0168 |
| 國別 | TW |
| 產品分類 | PV: Cells · PV: Modules · PV: Stand-Alone Systems · Solar Thermal · Backgrind; Slicing; Lapping; Polishing Equipment · Cleaning; Washing Equipment for Assembly & Packaging · Cut & Down Set; Trim; Form Equipment · Deflashing; Degating Tools · Dicing; Sawing; Scribing; Separation Equipment · Die Bonding; Attach Equipment · Die Sorter; Pick & Place; Flip Chip Placement Systems · Dispensing Systems · Plating; Electro Chemical Plating for device assembly · Liquid Crystal Injection or Filling Equipment · Lamination; Sheet Laminating Equipment · Vibration Isolation Systems · Flat; Notch Finding System · Wafers · Bumping Systems · Chemical Mechanical Polishing (CMP); Electro Polishing, Mechanical Polishing Equipment · Cleaning; Washing; Drying Equipment for Substrate, Fab Processing · Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment · Etching; Stripping; Ashing - Dry and Wet Equipment · Plating; Electro Chemical Plating; Deposition Systems · Transfer Systems for Wafer; Reticles or FPD's · Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive · Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools · Lead Frames & Headers: Etched; Stamped · Molding; Encapsulation; Potting; Resin Materials · Package Substrates; Laminate; Film based · Packages; Ceramic and Other High Temp Compounds · Preforms; Lids · Scribe Tools; Saw or Dicing Blades and Accessories · Solder; Solder Balls and other Soldering Materials · Thermal Interface Materials; Heat Sinks · Thick Film Pastes; Materials · Cleaning Chemicals; Solvents; Strippers · Mask and Reticle Handling Products · CMP; Grind; Lap; Polish; Abrasive materials · Plating Materials · Test; Monitor Wafers; Reclaim or Virgin · Test Sockets; Contactors and Contact accessories · Filters, Getters, Purifiers, Catalysts for Gases · Temperature Sensing; Control; Recirculators; Chillers; Heat Exchangers · Robotics; Transfer Systems · Stockers; Storage, AMHS · Plating; Electro Polishing; Coating; Surface Treatment · Wafer Handling |
| 網站 | www.everteam.com.tw |
公司簡介
Ever Team International Corp. 是台灣半導體設備、材料與軟體代理/經銷公司，服務前段與後段電子製造。其提供 IC、LED、solar 與 electronics industries 從 front-end 到 back-end 的 equipment and material solutions。公司在台灣參與從 photomask 到 test 的半導體業務，產品範圍涵蓋 equipment、materials 與 software。Ever Team 營運已三十餘年，創立初衷是為台灣半導體業界引進高科技生產、測試設備及相關材料，並協助原廠與客戶之間的製程合作研發。其設有新竹與高雄辦公室。Ever Team 是涵蓋生產設備、測試設備、材料與軟體的半導體製造代理與解決方案通路，而非原始設備製造商。
展出產品
非 DMSO 乾膜剝離劑、離型膜剝離劑、Al2O3 蝕刻劑、PID 剝離劑、非 DMSO 液態膜剝離劑
能力與產品項目
- Al2O3 Etching 材料或製程供應
- Non DMSO Dry film Stripper 供應
- Non DMSO liquid film stripper 供應
- PID Stripper 供應
- Release film Stripper 供應
- 半導體材料與軟體供應通路
- 半導體生產與測試設備供應
- 組裝與封裝用清洗、洗滌設備
- 背磨、切片、研磨與拋光設備