At a glance
| Booth | N1367 |
| Website | www.eternal-epm.com |
Company profile
ETERNAL PRECISION MECHANICS CO., LTD. was founded in 2022 and is a member of the Eternal Materials group, which is identified as a materials supplier with 60 years of activity in Taiwan. The company follows the group operating concept of manufacturing quality products to serve customers and combines this background with vacuum-lamination equipment development and design experience. Its 100%-owned Japanese subsidiary, Nikko-Materials Co. Ltd., has more than 20 years of experience in developing and designing vacuum-lamination equipment. The company states that its lamination equipment has a 95% share of the global IC-substrate industry and equipment yield of 98.5%. ETERNAL PRECISION MECHANICS CO., LTD. is expanding production capacity while investing more resources in innovation and development of IC and semiconductor process equipment to respond to customer needs and industry development. Its products are used in application fields that include AI, 5G networks, facial-recognition systems, communications systems, vehicle systems, and PC/NB equipment environments. Public registration information included in the company introduction places its business in machinery for electronics and semiconductor production, together with repair and installation of industrial machinery. This business scope positions ETERNAL PRECISION MECHANICS CO., LTD. as a precision-machinery and semiconductor or electronics production-equipment manufacturer within the Eternal Materials group. The company also states that world-class leading manufacturers have designated its lamination equipment as a cooperation choice, linking the stated 95% IC-substrate market share and 98.5% equipment yield with customer adoption. The registered scope therefore extends from manufacturing machinery for semiconductor and electronics production to repair and installation of industrial machinery, clarifying the group company's precision-machinery and production-equipment role.
Exhibits
Vacuum laminators are highly automated and are available as fully automatic, semi-automatic, and custom-designed machines using proprietary film-handling technology and vacuum-lamination modules to improve substrate lamination flatness, precision, and production efficiency. The equipment is used for IC-substrate packaging and also applies to PCB, FPC, NCF, LED, and PC/NB processes. Vacuum processing provides high-fill lamination over substrate surfaces with fine circuitry and vias, while high-precision thermal pressing keeps laminated substrates at uniform thickness and surface flatness. The vacuum-lamination technology uses vacuum to combine film and substrate with high fill, helping avoid bubbles and wrinkles and improve product precision for processes with demanding quality requirements. The product structure includes single-stage, two-stage, and three-stage vacuum-laminator series. Single-stage models listed for the series are V130, V160, EFV-1000 (Litho. D/F), and CV-600 (Litho., DFSM). Two-stage models are CVP-600, CVP-700, CVP-500, and CVP-300. Three-stage models are CVP-1700SP and CVP-1600SP. Across these machine formats, the company combines film handling, vacuum lamination, high-fill coverage of fine features, and high-precision thermal pressing for substrate-processing requirements. The product page groups the listed machines by stage configuration, allowing the single-stage V-series and lithography-related models, the four CVP two-stage models, and the two CVP-SP three-stage models to be distinguished within the vacuum-laminator family.
Capabilities and products
- fully automatic vacuum laminators
- semi-automatic and custom vacuum laminators
- vacuum lamination for IC substrates, PCB, FPC, and NCF
- high-fill vacuum lamination for fine lines and vias
- high-precision thermal pressing for uniform thickness and flatness