At a glance
| Booth | S7941 |
| Country | TW |
| Website | zh-tw.dyfenco.com |
Company profile
Dyfenco International Co., Ltd. was founded in November 1979. The company has group operations in Taiwan, India, Vietnam, Thailand, Malaysia, China, Indonesia, and the Philippines. Dyfenco International Co., Ltd. supplies soldering materials and related assembly materials for electronics and semiconductor packaging. Its semiconductor-material business covers a broad range of soldering materials for semiconductor assembly and packaging. Those semiconductor soldering materials are manufactured under precisely controlled conditions to meet semiconductor-grade quality. Development work is connected with flip-chip packaging, system-in-package, MEMS and sensors packaging, and embedded-die technology. The company’s combined product and application scope connects semiconductor packaging with broader electronics assembly and manufacturing markets. Its original product listing covers Solder Paste, Solder Wire, Solder Bar, Liquid Flux, Cleaner, and Solder Preform for IC Package, PCB Fabrication, PCBA, Automobile, and LED applications. The eight-country operating footprint provides the geographic base for supplying electronics and semiconductor-packaging materials across multiple Asian manufacturing markets. Its stated application list combines IC Package, PCB Fabrication, and PCBA with Automobile and LED markets.
Exhibits
Dyfenco International Co., Ltd. supplies soldering materials including solder paste, solder wire, and solder bar. Its electronic-grade chemicals include liquid flux, electronic-product cleaners, flux paste, surface-mount-technology adhesive, and solder preforms. The listed application fields are automotive electronics, the information and communications industries, LED lighting, and the semiconductor industry. Highlighted products include ultra-fine solder paste for microelectronics and Sti(R) high-reliability materials. The electronics-cleaner range uses a distinctive formulation intended to replace chlorofluorocarbon cleaners or air-hazardous cleaners. The cleaners are made to provide cleaning solutions with effectiveness, stability, and predictability. Solvent-based cleaners are intended for manual wiping and spray-cleaning systems. SMT Cleaner 128 is identified as a high-performance, safe and reliable stencil cleaner. PCB127A is identified as a high-efficiency, fast-reacting cleaner. 5018 is identified as a high-strength, non-chlorinated cleaner. Water-based cleaners are intended for batch immersion and in-line cleaning systems. WSC742 is a formulation designed for the automotive industry that is described as free of hazardous substances and biodegradable. Across the wider portfolio, solder paste, solder wire, solder bar, liquid flux, electronic-product cleaners, flux paste, surface-mount-technology adhesive, and solder preforms support semiconductor, electronics, automotive, communications, and LED-related manufacturing. The cleaner portfolio therefore includes both solvent-based and water-based cleaning routes, with use cases ranging from manual wiping and spray systems to batch immersion and in-line cleaning. The named cleaner models cover stencil cleaning, fast-reacting cleaning, non-chlorinated high-strength cleaning, and an automotive-oriented biodegradable water-based formulation.
Capabilities and products
- solder paste
- solder wire
- solder bar
- liquid flux
- electronics cleaners
- flux paste
- SMT adhesive
- solder preforms
- ultra-fine solder paste for microelectronics