基本資料
| 攤位 | L0410 |
| 國別 | SG |
| 產品分類 | Backgrind; Slicing; Lapping; Polishing Equipment · Device Handling; Feeding Systems · Dicing; Sawing; Scribing; Separation Equipment · Die Bonding; Attach Equipment · Die Sorter; Pick & Place; Flip Chip Placement Systems · Dispensing Systems · Lead Frame Taping Systems · Package Handling; Conveying Equipment · Package Simulation; Characterization Equipment · Solder Reflow; Soldering & Brazing Equipment · Wafer Level Bonders · Wafer Mount; Taping Equipment · Wire Bonding Equipment · Lamination; Sheet Laminating Equipment · Sealing; Bagging; Packing Equipment · Space simulation; Vacuum chambers · Vacuum drying & out gassing Systems · Air Velocity (VA) Humidity and Moisture Sensing · Defect; Particle; Bump; Contamination Detection, Review or Inspection · Wire Bonding Inspection; Test · X-ray; XRF; 3-D X-Ray; LEXES Systems · ESD; EMS and Latch-up Systems · Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive · Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools · Lead Frames & Headers: Etched; Stamped · Packages; Plastic · Thick Film Pastes; Materials · Cleaning Chemicals; Solvents; Strippers · Clean Rooms · Contamination Control; HEPA Filtering Systems · HVAC; Temperature; Humidity Systems and Control · Static; ESD Control · Clean Room; Contamination Control · Wafer Handling |
| 網站 | www.douyee.com |
公司簡介
Dou Yee Enterprises (S) Pte Ltd（DYE）成立於 1982 年，是領先的整體工業解決方案供應商，服務半導體、資料儲存、生物醫療與電子產業。DYE 專精於製造具靜電釋放與濕度控制特性的電子封裝材料、無塵室服裝與鞋具等。完整的產品系列使我們成為便利的一站式工業供應商。憑藉遍及 19 個國家、超過 39 個據點的全球業務網絡，DYE 為客戶提供因應在地需求量身打造的全方位全球解決方案。Dou Yee Enterprises (S) Pte Ltd 專精領域包括：微污染控制、乾燥包裝／電子封裝材料、靜電防護／導電材料、電子設備與工具、生物醫療、電子產業用化學品、個人防護裝備。
能力與產品項目
- ESD 與導電材料
- 乾燥包裝與電子包裝材料
- 具濕度控制的電子包裝材料
- 具靜電放電控制的電子包裝材料
- 微污染控制
- 潔淨室服裝與鞋類
- 電子設備與工具