At a glance
| Booth | J2346 |
| Country | TW |
| Website | www.das-ee.com |
Company profile
DAS Environmental Expert GmbH develops and manufactures environmental-technology systems for waste-gas and wastewater treatment, with scalable treatment solutions serving technology industries that include semiconductor, solar, and LED manufacturing. The business was established in 1991 and is headquartered in Dresden, Germany, providing a long-standing organizational base for the development, production, and support of waste-gas and wastewater treatment systems. DAS EE reports more than 950 employees across 10 offices worldwide, giving its environmental-treatment activities an international operating and service footprint. High-technology customers use several thousand installed DAS EE abatement tools, and the service team can maintain those systems 24/7, combining a large installed base with continuous maintenance capability. The company's semiconductor focus includes the reduction of greenhouse-gas emissions associated with manufacturing processes, electricity use, and the wider supply chain, reflecting Scope 1, Scope 2, and Scope 3 emission categories described for the semiconductor ecosystem. Within that emissions-reduction work, DAS EE offers customized Burn-Wet systems and links their Destruction and Removal Efficiency performance to support for a stated goal of minimizing CO2 emissions by 40%. The treatment portfolio therefore addresses both waste-gas abatement and wastewater treatment for semiconductor and other technology production, while service support extends from installed treatment tools to around-the-clock maintenance.
Exhibits
OTTELIA removes silicon dioxide (SiO2) particles from process wastewater and is intended especially for wastewater generated by wet-chemical cleaning and etching processes in semiconductor manufacturing. By targeting SiO2 particles in these wet-chemical and etching wastewater streams, OTTELIA addresses a specific particulate-removal requirement on the wastewater side of semiconductor production rather than waste-gas treatment. TILIA is a disposal system for pyrophoric, fluorinated, toxic, or long-lived environmentally harmful gases and reaction products, covering several hazardous process-gas and by-product categories in one treatment platform. The TILIA system is also described as having an efficient footprint-to-throughput ratio, connecting its treatment role for hazardous gases with the amount of processing capacity delivered within its installed area. TSUGA combines selective catalytic reduction (SCR) with ammonia for NOx reduction of up to 95% and adds a membrane filter for particulate-matter removal of up to 99.9%, integrating gas-reaction treatment and particle filtration in the same system description. Particle Separators remove dust, aerosols, and condensates from waste-gas streams, using either electrostatic fields to capture fine and ultrafine particles or mechanical separation based on centrifugal forces depending on the application. The EDC, or Electrostatic Dust Collector, is an electrostatic micro- and nanoparticle separator that treats particle- or aerosol-contaminated process waste gas directly at the point of use, placing particle control close to the point where the process waste gas is generated. Together, OTTELIA, TILIA, TSUGA, the Particle Separators, EDC, and customized Burn-Wet systems cover wastewater particles, hazardous waste gases, NOx, particulate matter, dust, aerosols, condensates, and broader gas-abatement needs relevant to semiconductor manufacturing.
Capabilities and products
- waste-gas and wastewater treatment systems for high-tech industries
- SiO2 particle removal from semiconductor cleaning/etching wastewater
- abatement of pyrophoric, fluorinated, toxic and long-lived harmful gases
- SCR ammonia NOx reduction up to 95%
- membrane filtration particulate removal up to 99.9%
- dust, aerosol and condensate separation from waste-gas streams
- electrostatic micro- and nanoparticle waste-gas treatment