At a glance
| Booth | L1104 |
| Country | JP |
| Website | www.dong-xu.co.jp |
Company profile
D&X Co., Ltd. is a semiconductor company based in Tokyo, with sales covering Taiwan, China, South Korea, Southeast Asia, the Americas, and Europe. Founded on 8 April 2008, the company specializes in semiconductor materials and has built activities in tape production, silicon wafer processing, sales, research, and development. Its company activity is the sale of semiconductor materials, and its product and service categories include silicon wafers, tape, other materials and products, stocklist supply, and processing services. D&X states an initial capital of 10 million JPY and describes “Growth and Gratitude” as a company principle, together with a business model centered on high-quality products and short delivery periods. From 2008 to 2012, the company began semiconductor tape research and development and mass production, improved development procedures based on customer requests, and expanded tape exports from Asia to manufacturers in other regions. As demand for semiconductor wafers increased, it entered silicon wafer sales and export, and in 2012 it moved its headquarters to Kabe and added warehouse capability to support shorter wafer lead times. During the following expansion, sales and exports grew across Asia and later into North America and Europe, and the headquarters was relocated again to Nishitama in 2019. D&X Co., Ltd. obtained ISO 9001:2015 certification for its management system on 7 November 2020 and states that it is certified to both ISO 9001:2015 and ISO 14001:2015. The ISO certifications cover processing and sales of semiconductor wafers as well as manufacturing and sales of semiconductor-related tapes and consumables. The company describes a “Sanpo-yoshi” management philosophy in which commerce should benefit the buyer, the seller, and society, alongside principles of contract spirit, challenge spirit, and mutual respect. Its homepage lists more than 500 customers worldwide and more than 1000 inventory categories, and the stocklist includes Bare Wafer, SOI Wafer, Film Wafer, SiC Wafer, Glass Wafer, Compound Materials, and Other Materials. The same product structure includes Back-Grinding Tape, Dicing Tape, Bumped Tape, quartz wafers, glass wafers, sapphire, solar wafers, and processing services such as thin-film or metal-film work, precision grinding and thinning, dicing, lithography, bumping, and bonding.
Exhibits
D&X develops and produces semiconductor tape in Japan, including dicing, grinding, heat-resistant, and bumping tapes in both UV and Non-UV formats, with customization for semiconductor applications. Its wafer supply ranges from 1-12 inch sizes and from dummy to prime grades, with wafers from major Japanese manufacturers and options that include special insulating films and metal films. In addition to silicon wafers, the company supplies sapphire, silicon carbide, SOI, glass, and gallium arsenide wafers for company and research use. The broader materials range also includes quartz wafers and solar wafers, while wafer-related services include dicing, grinding, thinning, bonding, polishing, and coating. D&X presents its Made in Japan tape line as a comprehensive set of high-performance tapes for semiconductor manufacturing and offers Back-Grinding Tape, Dicing Tape, and Bumped Tape. Its Back-Grinding Tape is described with strong adhesion to prevent water damage, no adhesive residue to keep adherends clean, flatness to support grinding, and usability on uneven surfaces such as bump wafers. Its Dicing Tape is described with strong adhesion, no adhesive residue, flatness for grinding, and compatibility with uneven surfaces, while the dedicated dicing-tape specifications add uniform expansion, chipping reduction, whisker prevention, and high heat resistance for precise die separation. Its Bumped Tape is designed to reduce warping during ultra-thin grinding, provide heat resistance during grinding and polishing, protect films over long periods and from heat, provide antistatic behavior during peeling, resist chemicals, acids, and bases, and protect high bumps. The dicing-tape line includes DX-TAD80CN-R for DC use on Silicon Wafer in Non-UV format with support for small chips, and DX-TAD85C-R for DC use on Silicon Wafer in UV format with chipping prevention and support for small chips. DX-TAD95C is a UV DC tape for Silicon Wafer that is transparent and highly expandable, while DX-TAD95C-R adds RoHS2.0 compliance and DXーTAD95C-AS adds RoHS2.0 compliance plus antistatic properties. DX-TAU75 and DXーTAU115 are UV DC tapes for Glass and Ceramic, while DXーTAU125B is a UV DC tape for Packaging substrates and hard to cut surfaces with strong adhesive properties. DX-M08P05S is a UV DC tape for Glass, Si Wafer, SBS, and Metal with low peeling strength after UV, and DXーTAP100 is a UV DC tape for Packaging Substrates and Glass. DX-M14P10S and DXーTAP165D are UV DC tapes for Packaging substrates with strong adhesive properties and chipping prevention. DXーTAP165EーAS is a UV DC tape for Package substrates with strong adhesive properties, chipping prevention, and antistatic properties, while DXーTAP165 is a UV DC tape for Packaging Substrates and Glass. DXーTAB165C is a UV DC tape for Packaging substrates that prevents chipping and can be peeled by hand, and DX-TAB180C and DX-TAB180C-A are UV DC tapes for Packaging substrates that prevent chipping and provide good chip peeling by hand. Customized dicing-tape specifications are available in addition to the listed standard specifications. Its wafer processing offering includes thinning, dicing, polishing, and coating and is presented as a short-lead-time service for semiconductor projects. For wafer users, D&X also identifies wafer dicing, grinding, thinning, and bonding as available services. The combination of stocklist supply and processing services is intended to support semiconductor material requirements from wafer selection through mechanical and film-related processing.
Capabilities and products
- semiconductor back-grinding tape manufacturing
- semiconductor dicing tape manufacturing
- semiconductor BUMPING tape manufacturing
- UV and Non-UV semiconductor tapes
- 1-12 inch dummy-to-prime silicon wafer supply
- special insulating-film and metal-film wafer supply
- sapphire wafer supply
- silicon carbide SiC wafer supply
- SOI wafer supply
- glass and quartz wafer supply
- gallium arsenide wafer supply
- wafer dicing
- wafer grinding
- wafer thinning
- wafer bonding
- wafer polishing
- wafer coating