Chung King Enterprise Co.,Ltd

Exhibitor at SEMICON Taiwan 2026 · Booth I2726

Booth I2726Country TW27 product topics
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BoothI2726
CountryTW
Websitewww.ckplas.com
Exhibitor profile

Company profile

Chung King Enterprise Co.,Ltd supplies automated transport carrier equipment for the semiconductor, LED, TFT-LCD and solar-energy industries, and CKplas describes itself as the world’s only supplier whose automated carrier equipment spans all four sectors. Its experience covers storage, protection and transportation solutions for high-technology products including precious metals, reticles, masks, wafers and glass, with these capabilities positioned for evolving semiconductor processes and the global AI wave. For advanced packaging, CKplas provides automated transport carriers and equipment for 2.5D, 3D, CoWoS and FOPLP applications. The company describes rapid adaptation to market changes and product design and development as part of its operating capabilities. Its semiconductor-supply-chain services include automation equipment integration, Class 1 wafer cleaning, micro-contamination prevention and ion-contamination detection. CKplas also describes a total-solution approach in cleanroom process environments, using polymer materials in carrier, protection and transport devices for valuable metal materials, wafers, photomasks and panels and customizing those devices to the automation equipment used in different processes.

Exhibitor profile

Exhibits

The semiconductor wafer-carrier range includes FOUP, FOSB and SMIF Pod products, Teflon and PFA cassettes, PP, PEI and PC cassettes, Metal and PEEK cassettes, and Shipping Box, Single Tray and Storage Box formats. Wafer-carrier size coverage is listed at 150mm, 200mm and 300mm, and the stainless-steel custom range includes Metal Frame, Wafer Frame and Wafer Ring products. Packaging and testing products include IC Tray, LED Tray, Frame, Frame FOUP, Frame Cassette and Frame Box, while reticle handling includes Mask Package Box, RSP 150 and Mask SMIF Pod. Additional carrier families include Square Glass Cassette and panel-level packaging panels, Solar Cassette and Clean Cassette products, and Normal Cassette products used with semiautomatic carts for glass-substrate transport. The opto-semiconductor equipment range includes test fixtures and inspection systems, alongside plastic-steel manufacturing services such as mold-injection OEM work, board and bar processing, components and machined assemblies. Packaging and testing products also include 12-inch Frame FOUP, 12-inch Frame FOUP Plus, 12-inch Frame FOUP ADV, 8-inch Frame FOUP and an 8-inch-to-12-inch FOUP converter for Tape Frame applications. It also lists 12-inch Frame Light Cassette, 8-inch and 12-inch Frame Airtight Cassette, 8-inch and 12-inch Metal Frame Cassette, IC Tray Cassette, OHT IC Tray Cassette and Magazine Cassette. Frame-box and frame-shipping options cover 6-inch, 8-inch and 12-inch Frame Box, 6-inch, 8-inch and 12-inch Metal frame, 8-inch Plastic Frame, 8-inch and 12-inch Metal Frame Shipper, and Wafer Metal Frame Shipper in ESD and thick-box versions. Wafer-expander products include 6-inch, 7-inch, 8-inch and 12-inch Wafer Expander Rings, an 8-inch Hoop Ring Cassette, 5-inch, 6-inch and 8-inch Hoop Ring Shippers including an ESD version, plus 7-inch and 13-inch Reel Box, IC Box, IC Tube Box and Tray Packaging. The Shipping Box family spans 2-inch, 2.5-inch, 3-inch PP, 4-inch, 5-inch, 6-inch and 8-inch sizes, with variants including ESD, Thin Wafer, 1.3T, PC and PC ESD versions. Single Tray offerings include 2-inch, 4-inch, 6-inch PP, 6-inch ESD, 6-inch PC, 8-inch and 12-inch formats, while Storage Box offerings cover 2-inch through 8-inch sizes with ESD and sliding-latch variants. The same carrier range includes 8-inch and 12-inch Wafer Stack Box, Wafer Coin Box sizes from 4-inch to 8-inch including 6.25-inch, 2-inch and 4-inch Ingot Case, LED Tray, Smart Foldable Cycle Box and reusable pallets. For 200mm wafers, CKplas lists an 8-inch 13 Slot FOUP, a FOUP converter, 8-inch Wafer SMIF Pod, standard and hollow 8-inch Teflon Cassette, 8-inch Low Profile Teflon Cassette, 8-inch 13 Slot Teflon Cassette and Teflon Wafer Tray. The 200mm range also includes 8-inch PP ESD Wafer Cassette, 25-slot and 13-slot PEI ESD variants, slim-type and back-support PP ESD variants, Double Slot Cassette, 8-inch 13 Slot Special Wafer Cassette, and 8-inch PEEK Cassette in 25-slot and 13-slot versions. Other 8-inch products include Metal Cassette, Shipping Box in standard, PC and PC ESD versions, Single Tray, Storage Box and Storage Box ESD, Wafer Stack Box, Wafer Coin Box, Frame Airtight Cassette, Metal Frame Cassette, Frame Box, Plastic Frame, Metal frame, Metal Frame Shipper and Wafer Expander Rings. Cleanroom equipment includes cleaning services, automated cleaning machines and the CKplas Cleaning Cycle; CKplas also lists cassette conversion tools, in-house optical inspection equipment, ultrasonic cleaning equipment, desktop cleaning equipment, single-tank cleaning and round-bar coating cleaning. The tank-type ultrasonic cleaning machine can be customized by tank size and is offered at 40/80KHz(E), 28/80KHz(U) or 25/45KHz(Q), with power from 300(A) to 7200W. The desktop cleaner uses a SUS304 inner tank of 350 x 350 x 200mm (24L) and an outer tank of 515 x 394 x 400mm, with the same frequency options and power of 300(A) or 600W(B). An automatic six-tank ultrasonic cleaning machine is also listed with customizable tank dimensions, the same three frequency combinations and power from 300(A) to 7200W. CKplas explains that higher ultrasonic-cleaning frequencies suit finer objects, remove smaller particles and reduce vibration damage to the cleaned object, so frequency can be selected according to the contamination and cleaning requirement. Its CFRP work covers carbon-fiber-reinforced polymer development and application; CKplas describes carbon fiber as over 90% carbon and CFRP as lighter than aluminum, stronger than steel, more corrosion-resistant than stainless steel, more heat-resistant than plastic, electrically conductive like copper and resistant to thermal deformation. CKplas states that its CFRP composite materials are already used across semiconductor, green-energy and biomedical-material fields, and it develops them in parallel with customer requirements. For ESG-oriented wafer-box reuse, CKplas combines FTIR plastic analysis with its green cleaning line to detect volatile organic contaminants (VOCs) and uses Reused FOSB and Reused Shipping Box processes intended to extend product life while limiting degradation during recycling. Its semiconductor wafer-box cleaning services cover upstream, midstream and downstream users and include FOSB shipping boxes, FOUP, Frame FOUP, RSP and 3D IC Glass cleaning; the company also reports receiving a two-star recognition from Taiwan’s environmental authority for promoting recycled-material circulation. The outbound workflow is described as supporting smart-factory logistics with automated loading, remote monitoring and reusable products, and CKplas reports orders from a world-class leading semiconductor manufacturer. For Reused FOSB and Shipping Box, cleaning-production history is controlled and inspection standards are set for exterior wear and chemical processes according to customer reuse cycles to determine whether a carrier can be cleaned and reused again. Its reuse range includes 12-inch Reused FOSB models such as CKplas SH-B300, Miraial KT3004A, KT3005A, KT3004A-4, KT-3002D and KT-3002HB, Shin-Etsu(SEP) MW300GT, Entegris SB300, 3S GSW300 and DAINICHI SF300-02. Reused Shipping Box examples include 8-inch Shin-Etsu(SEP) MW200N-A3 and MW200N-A5 and Entegris Crystalpak and Ultrapak products.

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