At a glance
| Booth | N0052, N0055 |
| Country | CN |
| Website | exhibitors.semi-e.com/jtycn/zs940.html |
Company profile
AMIES Technology Co., Ltd. is a China-based semiconductor equipment company focused on high-end process and measurement tools and on equipment solutions characterized by high precision, high performance, and high reliability. The company's official identity is Shanghai AMIES Technology Co., Ltd., and it was founded in February 2025 to conduct research and development, production, and service for high-end semiconductor equipment. Its application focus includes More-than-Moore chip manufacturing, a field for which the company states that it provides equipment solutions with high precision, high performance, and high reliability. AMIES Technology Co., Ltd. also serves IC front-end chip manufacturing, extending its high-end equipment work into front-end semiconductor manufacturing applications. Advanced packaging is another stated field, including chip advanced packaging and the more specific wafer-level and panel-level advanced-packaging applications identified by the company. The company further serves third-generation semiconductors, compound semiconductors, and new-display applications, giving its equipment work a scope that spans semiconductor manufacturing, packaging, compound materials, and display-process environments.
Exhibits
The published product fields include lithography equipment for compound semiconductor and LED applications, placing lithography among the company's high-end semiconductor process-tool categories. SiC laser annealing is another stated product field, adding laser-based thermal processing equipment for silicon-carbide semiconductor applications. FPD exposure systems are included in the product portfolio for flat-panel-display process applications. Measurement equipment is part of the published product scope, complementing the company's process-equipment work with measurement capability. Photoalignment equipment is also listed, providing process equipment for display-related alignment applications. Fine metal mask tensioning equipment completes the published set of product fields identified in the company introduction. Across these product fields, the company states that its equipment solutions are intended for More-than-Moore chip manufacturing, IC front-end chip manufacturing, wafer-level and panel-level advanced packaging, compound semiconductors, third-generation semiconductors, and new displays. AMIES Technology Co., Ltd. describes the common performance direction of these equipment solutions as high precision, high performance, and high reliability for the core application fields it serves. Taken as a portfolio, the listed fields combine patterning and exposure, laser thermal processing, measurement, alignment, and mask-handling equipment for the semiconductor and display application areas named by the company.
Capabilities and products
- equipment solutions for IC front-end, advanced packaging, compound semiconductors and new displays