Topco Scientific Co., Ltd.

Exhibitor at SEMICON Taiwan 2026 · Booth I2700

Booth I2700Country TW12 product topics
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BoothI2700
CountryTW
Websitewww.topco-global.com
Exhibitor profile

Company profile

Topco Scientific Co., Ltd. was founded in 1990 with the philosophy of “diligence, professionalism, and sharing the success” as it entered the advanced-technology field. The company states that it actively introduces new manufacturing processes and technologies and combines strategic planning, efficient execution, and global logistics-management capability to provide integrated services to customers. In advanced-technology markets, Topco says it pursues reliable quality, punctual delivery, and responsive service in order to meet customer needs. Its supply scope for the semiconductor, LCD, and LED industries includes precision materials, manufacturing equipment, and components, together with system-planning and integration services. Following its stock IPO in 2003, Topco continued expanding its operating scope and global market presence and extended into environmental-protection and green-technology projects including plant wastewater treatment, clean rooms, and solar power plants. To support that expansion, it built a supply-chain and service network that covers integrated services from design and construction through operation and maintenance. Topco states that continuing growth in annual revenue and profitability reflects recognition of its professional integration capability by customers around the world.

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Exhibits

Topco also describes itself as an all-round supplier across the high-technology industry supply chain and says its operating strategy combines professional management, early expansion into new business fields, and the introduction of new products, technologies, and services. It states that its operating scope and business footprint have expanded over the years and that its business activities create social value in addition to revenue and profit performance. For semiconductor processing, Topco offers a high-adhesion, easy-release UV tape intended to support new process development through heat resistance and release technology, including protection of devices during thermal packaging processes such as reflow. The UV release tape combines high adhesion with easy peel-off; after UV irradiation, gas is generated between the tape and the adherend so the tape can be removed with essentially no applied force, including from ultra-thin ground wafers without damage. The product portfolio includes the heat-resistant single-sided HS series, the heat-resistant double-sided temporary-bonding HW series, and the chemical-resistant MP series, allowing a suitable model to be evaluated for the intended process application. Tape specifications can be adjusted according to use requirements. Related products listed with this semiconductor-material offering include electronic-grade coatings, TPX release film, thermocompression conductive film, conductive rubber, and PI tape. Together with its precision-material and manufacturing-equipment supply for semiconductor, LCD, and LED customers, these materials fit within Topco’s broader system-planning, integration, logistics, construction, operation, and maintenance service scope.

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