At a glance
| Booth | R8106 |
| Country | TW |
| Website | www.3axlelaser.com |
Company profile
TAIWAN 3AXLE TECHNOLOGY CO., LTD. works in laser technology and is mainly engaged in the research and development, production, and sales of multiple types of laser equipment. Its product range includes ultra-precision cutting equipment, low-power laser cutting and engraving machines, laser marking and engraving machines, laser welding and cleaning equipment, high-power fiber metal laser cutting machines, and fiber laser tube cutting machines. After decades in the laser industry, the company states that it has grown steadily while continuing technological innovation and product development. It combines design aesthetics with laser-equipment development and focuses on providing faster and more accurate laser-processing equipment for higher-end requirements across different industries. Responding to increased demand for ultrafast and ultraprecision laser processing in semiconductor equipment and electronics, the company supplies precision drilling machines, ultrafast laser glass cutting machines, thick-glass cutting all-in-one machines, double-head roll-to-roll PI film cutting machines, PET film cutting machines, photovoltaic glass drilling machines, double-platform front-cutting and rear-cracking all-in-one machines, and four-head automotive glass film-removal machines. These laser solutions are presented as tools for solving processing problems, optimizing processing and production processes, and improving the quality of customers' products through high-precision machines. The semiconductor and electronics-oriented equipment list also includes PET film cutting machines, photovoltaic glass drilling machines, and double-platform front-cutting and rear-cracking all-in-one machines, in addition to the precision drilling, ultrafast glass cutting, thick-glass, and roll-to-roll PI-film systems.
Exhibits
The integrated laser glass cutting and breaking machine combines infrared picosecond laser cutting with CO2 laser thermal breaking in a single cutting-and-breaking process designed for precision work on brittle materials. The machine is specified for a maximum processing speed of 500mm/s and can process glass up to 12mm thick. Consumer-electronics and display applications include mobile-phone cover glass, automotive display panels, and glass for wearable devices. Optical and semiconductor applications include protective glass for optical lenses, filters, semiconductor glass carriers, and MEMS packaging. Medical and biomedical applications include medical-testing glass and microfluidic chips, while smart-appliance applications include touch-glass panels and industrial-control panels. By replacing conventional wheel cutting, the process is described as avoiding microcrack risk and secondary polishing while substantially improving production-line yield and edge strength. The company's wider semiconductor and electronics offering also includes precision drilling machines and ultrafast laser glass cutting machines, alongside film, photovoltaic-glass, and glass-processing equipment for different production requirements.
Capabilities and products
- ultra-precision laser cutting equipment
- low-power laser cutting and engraving machines
- laser marking and engraving machines
- laser welding and cleaning equipment
- high-power fiber metal laser cutting machines
- fiber laser tube cutting machines
- precision laser drilling machines
- ultrafast laser glass cutting equipment
- roll-to-roll PI film laser cutting
- PET film laser cutting
- photovoltaic glass laser drilling
- integrated glass front-cut and rear-crack equipment