At a glance
| Booth | R7200 |
| Country | TW |
| Website | www.taichimetal.com |
Company profile
Taichi Metal Material Technology Co., Ltd. was founded in 2017 and focuses on liquid-alloy design, material applications, related process equipment, and technology research and development, while building an international patent position around liquid-alloy applications. The company has put two liquid alloys, TC-1 and TC-2, into mass production and describes these materials as having strong material, mechanical, and chemical properties together with stable quality and reasonable cost. Current liquid-alloy applications named by the company include sputtering alloy targets, enhancement of material properties, rust and corrosion prevention treatments, extension of mold and workpiece service life, reduction of process cost, and reduction of process pollution emissions. Taichi Metal Material Technology Co., Ltd. is also developing high-strength lightweight structural materials, wafer and PCB cutting, wafer regeneration, component regeneration, surface-film removal, special microstructure building materials, and other advanced-process applications, and it states that these development areas have obtained invention patents in multiple countries. By applying the property advantages of liquid alloys, the company offers customized integrated solutions, technology upgrades, and transformation support intended to meet industry needs and help enterprises improve competitiveness.
Exhibits
The product range includes liquid-alloy powder materials and liquid-alloy sputtering targets, extending the company's liquid-alloy work from material formulation into supply forms used for further application and processing. Taichi Metal Material Technology Co., Ltd. also lists particle-beam cutting and thinning technology as a process capability. Its product listings include a manual bead blasting machine, laser confocal surface measurement, a thermal-radiation insulation film, and heat-dissipation performance enhancement. The TCM 6090 thermal-radiation insulation film is listed with 60% light transmittance, 90±2% infrared heat-insulation rate, and 99.9% ultraviolet blocking rate. The TCM 7090 is listed with 70% light transmittance, 90±2% infrared heat-insulation rate, and 99.9% ultraviolet blocking rate. The company's development scope also includes wafer and PCB cutting, wafer regeneration, component regeneration, and surface-film removal, providing process-oriented application areas alongside its liquid-alloy materials and equipment work. For liquid alloys already in mass production, TC-1 and TC-2 are associated with applications such as sputtering alloy targets, material-property enhancement, corrosion-related treatment, longer mold and workpiece life, process-cost reduction, and lower process pollution emissions. These offerings are positioned together with customized integrated solutions and technology-upgrade support, allowing the company to combine materials, application development, process technology, and equipment-related work within customer-specific projects.
Capabilities and products
- liquid-alloy design and material applications
- liquid-alloy powder materials
- liquid-alloy sputtering targets
- particle-beam cutting and thinning
- wafer and PCB cutting
- wafer regeneration
- component regeneration
- surface-film removal
- manual bead blasting machines
- laser confocal surface measurement
- thermal-radiation insulation films