At a glance
| Booth | N0866 |
| Country | CN |
| Website | www.merryprobe.com |
Company profile
Shenzhen Merry Precise Electronic Co.,Ltd designs, manufactures, and sells probes used in PCB, ICT, semiconductor, and other fields. It uses precision machine tools and testing machines imported from Japan and Switzerland, advanced production and processing technology, and a technical team, and it continuously improves production skills and product quality. The company presents professionalism and integrity as operating principles, provides products and services to clients worldwide, and focuses on R&D of high-density probes. Its major probe products are comparable with well-known probe brands worldwide.
Exhibits
Product families include ICT probe series, Semiconductor probe series, FPC series, PCB probe series, Probe connector, Precise Jig, and High-current probe. Round-rod tungsten needles are used as argon-arc welding electrodes, especially for manual tungsten-inert-gas welding, while pointed tungsten needles are used mainly as instrument probes for testing semiconductor-material resistance at semiconductor-material manufacturers, semiconductor-device manufacturers, research organizations, and universities. Pogo Pin offerings cover spring probes, probe connectors, and battery connectors, and PogoPin products save space, are available in many standard types, have a service life exceeding 10000 cycles, use point-to-point contact without displacement, and can be customized without investment in large equipment. The FPC test-probe fixture includes PIN upper and lower needle molds, a mold-reinforcement plate, PIN connection plate, mold fixing seats, an anti-interference plate, a PIN signal-transfer board, and an FPC pressure plate; it uses a high-precision multi-hole needle mold and signal-transfer board as the main structure, spring test needles whose tips alone can be replaced when damaged, an skd11 reinforcement plate, and a transparent acrylic pressure plate. The FPC fixture is structurally simple, reliable, and low-cost, does not require repeated positioning after repeated disassembly and assembly, and can provide up to 500600 PIN mold mounting holes in a limited area for testing more complex FPCs. During ICT, individual component parts are tested so defective parts can be identified and replaced, and probes can be selected with different installation lengths, pitches, probe-tip forms, and interface types. PCB probes are used in PCBA testing for data transmission and conductive contact, with different probe types and sizes for different requirements. High-frequency probe products include high-current probes, high-performance probes, test probes, threaded probes, high-frequency probes, and wire-harness probes; RF probe series are selected according to test points, frequency and/or data rate, available installation space, and environmental conditions, and have high measurement accuracy, long durability, high quality, and high cost-performance. Electrical probing of semiconductor chips integrated on wafers is used to identify good and defective products, with the company linking this testing need to expanding IoT- and 5G-related applications including automobiles, surveillance cameras, and smartphones. Listed products include Wire Probe, FPC spherical-end probe, FPC flat probe, MR-040, BHY-30, MR-050, BHY-20, MR-075, BHY-0, MR-100, BHY-1, BHY-2, a High current probe micro-plunger, a Precise Jig for chip testing, and double-ended needle models 031BF-6.7, 031BF-4.75, 051FB-5.7, 038FB-5.7, and 058FB-5.7.
Capabilities and products
- ICT test probes
- Semiconductor test probes
- PCB test probes
- Probe connectors
- High-current probes
- Microprecision FPC test probes
- Pogo Pin spring probes
- Battery connectors
- FPC test-probe holding fixtures
- RF probes
- Threaded probes
- Wire-harness probes
- Tungsten probes for semiconductor resistance testing
- Tungsten electrodes for argon arc welding
- Chip test fixtures
- Double-ended test probes
- Micro-plungers