At a glance
| Booth | P5221 |
| Country | TW |
| Product categories | Ball Placement; Attach Systems · Dicing; Sawing; Scribing; Separation Equipment · Die Bonding; Attach Equipment · Die Removal Equipment · Die Sorter; Pick & Place; Flip Chip Placement Systems · Dispensing Systems · Lead Frame Taping Systems · Package Simulation; Characterization Equipment · Solder Reflow; Soldering & Brazing Equipment · Wafer Level Bonders · Wafer Mount; Taping Equipment · Wire Bonding Equipment · Laser Treatment; Cutting Systems for Panels & Photocells · Cutting; Drilling; Laser ablation; Beveling Equipment · Repair; Rework Equipment · Acoustic Spectroscopy; Electron Spectroscopy for Chemical Analysis (ESCA); Ultrasonic; Acoustical Mi · Die Inspection; Die Shear · Microscopes: Atomic Force Microscopes (AFM) · Microscopes: Confocal Scanning Microscope; 3-D Video Microscopes · Microscopes: Optical Microscopes · Microscopes: Scanning Electron Microscope (SEM); Focused Ion Beam (FIB), Transmission Electron Micr · Package Inspection; Lead Scanners · Thermal Sensing, Measurement, Analysis · Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation · Wire Bonding Inspection; Test · X-ray; XRF; 3-D X-Ray; LEXES Systems · Equipment, Nanotechnology Tools · Optical Test Systems · Package Test Systems · Plasma Sources; Controls; Monitoring; Diagnosis · Ultrasonic Generators; Transducer and Monitoring Systems |
| Website | www.omega-cana-scientifics.com |
Company profile
The Omega Group was founded in Taipei in 1995 by its CEO. After more than two decades of dedicated operation, we have grown into a leading professional distributor in the two fields of scientific research and professional medicine. To suit the nature of the distribution business, the company comprises business units including the Scientific Instruments Division, Semiconductor Division, Medical Division, Blood Components Division, and New Products Division, and has an independent Service Department that provides maintenance and repair services for the various equipment and instruments of each division. The Group's Medical Division mainly distributes Abbott CV's cardiovascular drug-eluting stents and balloon catheters, serving as an important partner of Abbott CV in Taiwan; over the years we have made tremendous contributions to the treatment of countless patients with cardiovascular diseases. The Blood Components Division mainly distributes Terumo BCT's blood component separation and collection products and pharmaceutical-grade cell-cloning products, and is the largest supplier in Taiwan in the field of cells required for apheresis platelet collection, stem cell and mononuclear cell collection, and cell-cloning therapy. Omega Scientific Co., Ltd. is responsible for the business of the Group's Scientific Instruments and Semiconductor Divisions. The Scientific Instruments Division has nearly thirty years of experience in ultra-high vacuum products, ultra-low temperature products, and various measurement instruments and equipment, and has become a loyal partner of major universities, research institutes, and industry R&D units in Taiwan; this year it has also begun distributing quantum information control instruments, providing easy-to-use instruments for the research units in Taiwan studying quantum computers. The Scientific Instruments Division distributes many leading brands in the scientific research industry, including: Scienta Omicron, DCA Instruments, Kurt J. Lesker, OCI Vacuum Microengineering, UHV Design, Lake Shore Cryotronics, Attocube, Cryomech, Quorum Technologies, Linkam Scientific, Quantum Machines, Delft Circuits, Angstrom Engineering. To serve industry customers more professionally, we established the Semiconductor Division, focusing on advanced packaging, materials analysis, and high-end inspection applications. In addition to experienced sales engineers, the Semiconductor Division is staffed with dedicated application engineers and service engineers, committed to providing customers with the most professional, prompt, and complete technical support and after-sales service. As the semiconductor industry develops rapidly toward high-performance computing (HPC), artificial intelligence (AI), data centers, and high-speed transmission architectures, advanced packaging technologies such as COWOS (Chip on Wafer on Substrate) and CPO (Co-Packaged Optics) have become core market trends. We are also actively promoting related inspection and process equipment to help customers address the quality challenges brought by high-density interconnection, heterogeneous integration, optoelectronic integrated packaging, and high-frequency high-speed signal transmission. In the COWOS advanced packaging process, for key quality issues such as micro bumps, TSV, hybrid bonding, underfill, warpage, voids, and interlayer defects, we provide complete non-destructive inspection solutions; in the CPO co-packaged optics field, for packaging precision, thermal management, material reliability, and electrical stability during the integration of optical components and semiconductor chips, we provide high-precision inspection and materials analysis equipment to help customers improve yield and reliability. In addition, in advanced packaging processes, surface activation, de-bonding, decontamination, and pre-packaging treatment are also important factors affecting yield. We distribute Astro's Microwave Plasma Processing equipment, specifically applied in the advanced chip packaging field, which can be widely used in wafer-level packaging (WLP), fan-out wafer-level packaging (FOWLP), COWOS, CPO, hybrid bonding, and high-end substrate packaging processes. Through highly efficient and uniform microwave plasma technology, it effectively improves surface cleanliness, material adhesion, and process stability, further enhancing packaging reliability and product yield. The Semiconductor Division distributes Nordson's inspection products, including AMI non-destructive inspection machines, various Bond Testers, X-ray inspection machines, and plasma machines for cleaning samples. We also exclusively distribute Neocera Magma, a high-end inspection device that uses SQUID technology to perform non-destructive inspection of static defects in device circuits. In addition, we exclusively distribute DCA Instruments, providing oxide thin-film deposition systems applied to molecular beam epitaxy (MBE) and physical vapor deposition (PVD) technologies; we also distribute Kurt J. Lesker's physical vapor deposition (PVD) and atomic layer deposition (ALD) systems; and Lake Shore Cryotronics' cryogen-free ultra-low temperature (4K) four-point-probe wafer measurement platform and Hall effect measurement systems. We believe that, through a complete product line, a professional technical team, and an in-depth understanding of advanced packaging technology trends such as COWOS and CPO, we can become the most trusted partner for our customers in the fields of semiconductor processing, inspection, and materials analysis. To ensure our high-quality service, the company has invested substantial resources in obtaining Good Delivery Practice certification, ensuring that our employees and partner suppliers comply with Good Delivery Practice guidelines and deliver our high-quality products to our customers according to the highest standards. We have branch offices in Taipei, Hsinchu, Taichung, and Kaohsiung. With these locations, our enthusiastic and professional staff can provide customers with the most local and high-quality service at the fastest speed.
Capabilities and products
- Astro microwave plasma packaging processing
- COWOS non-destructive inspection
- MBE/PVD deposition systems
- Neocera Magma SQUID inspection
- Nordson inspection products
- measurement instruments and equipment
- quantum information control instruments
- ultra-high vacuum products
- ultra-low temperature products