At a glance
| Booth | I2300 |
| Website | www.machvision.com.tw |
Company profile
MACHVISION Inc. (TWSE: 3563), founded in 1998, is an optical-inspection equipment company specializing in machine-vision systems. Its core system architecture integrates optical imaging, image processing, precision mechanics, and motion control rather than treating inspection as an isolated camera function. The company provides non-contact precision measurement, AOI, AVI, and Laser Via inspection solutions for PCB, HDI, and IC substrate inspection. MACHVISION states that it introduced ultra-high-speed, high-resolution line-scan technology together with measurement capabilities progressing from 2D to 3D, with the aim of moving inspection from sampling toward full-scale quality assurance. Its operating philosophy combines advanced design, products, and comprehensive services, while its vision emphasizes using machine vision to improve customer quality and productivity. The company's milestones show a long development path in inspection and metrology: in 1998 it established its R&D Center and began developing a 2.5D measuring viewer, and in 1999 it began Hole AOI development after being approved to enter Hsinchu Science and Industrial Park. In 2000 it began developing BGA-related measuring technologies and a micro blind-hole measuring viewer, followed by LineGauge development and establishment of a Sales Department in 2001. By 2002, MACHVISION was promoting Alpha2000 and Hole-AOI in overseas markets and had started development of a gold-finger measuring viewer and related technologies. The company expanded its Operation Center in 2006 and established a Production Center in 2007, the same year its stock began trading on the emerging stock market. From 2008 onward, it invested in wiring-inspection, AFI, and 3D-measuring series, then launched a second version of AFI and 3D AOI in 2009 and Lead Frame AOI in 2010. Its stock began official trading on the Taipei Exchange in 2011, and the same period included launches of FGF, Roll-to-roll AOI, FVRS, large-table AFI, and FCCSP AFI in magazine form. Further product milestones included AFI2 300x400 in 2013, AOFI in 2015, Wafer AVI and AOI 4.0 in 2016, and RTR AOI in 2017. In 2017 MACHVISION also established an East China Semiconductor Unit to strengthen its global inspection presence and a Southern Taiwan Office in Kaohsiung to enhance customer-service support. The company introduced AI solution, AAVI, AutoAVI, and an on-line BVH detector in 2018, then expanded the inspection portfolio with AVI for Mini LED, Fine Line AOI4.0, index 4W tester, and flip-chip appearance and related inspection equipment in 2020. Later launches included MutiWave LV AOI in 2021, High Speed CSP AVI and Lead Frame AVI in 2022, the PanGu AOI Series in 2023, and High Capacity CSP AVI and the PereGrin Series in 2024. MACHVISION established a subsidiary in Thailand in 2023, adding another element to its international operating footprint alongside its semiconductor and customer-support expansion in East China and southern Taiwan. Recognition listed by the company includes the Taiwan Mittelstand Award in 2015, a top-5% result in the 2nd Corporate Governance Evaluation of Listed Companies in 2016, and the 25th National Quality Award's Total Excellence Category in 2018. It also lists Forbes Asia's 200 Best Under A Billion recognition in 2018, Hsinchu Science Park awards for innovative product and R&D accomplishment in 2019, and a Forbes Asia's 200 Best Over A Billion listing in 2019. The 2023 recognition list includes CommonWealth Magazine awards for corporate citizenship and talent sustainability together with a family-friendly workplace award, while 2024 includes the Ministry of Labor Work-Life Balance Award in the Family-Friendly Category.
Exhibits
MACHVISION's current product categories include Wafer AOI, Packaged IC AOI, PCB 4W ATE, and PCB inspection offerings. Wafer AVI is a high-efficiency inspection system engineered for semiconductor back-end assembly and testing as well as wafer fabrication processes. The Wafer AVI architecture integrates optical acquisition, advanced image-processing algorithms, and AI-driven deep-learning technologies to automate visual inspection tasks. Its objective is to replace conventional manual visual inspection, addressing labor cost and fatigue-induced errors while providing a fully automated inspection approach with high throughput and controlled inspection quality. For image acquisition, the system uses high-resolution line-scan imaging technology to balance inspection throughput with metrological accuracy during high-speed scanning. Wafer AVI is primarily used for final visual inspection after wafer dicing or before packaging, placing it at a critical transition point before dies move to the next process node. The system is particularly suited to mid-to-late-stage inspection in advanced packaging processes including FOWLP and CoWoS, where each die is checked against quality requirements before subsequent processing. Wafer AOI is also explicitly listed in the product range, complementing Wafer AVI within MACHVISION's semiconductor wafer-inspection portfolio. The broader company technology base of optical imaging, image processing, precision mechanics, and motion control provides the underlying integration framework for these automated inspection systems. Together with non-contact precision measurement and the company's AOI, AVI, and Laser Via capabilities, the semiconductor wafer products sit within a wider inspection platform that also serves PCB, HDI, and IC substrate applications.
Capabilities and products
- optical inspection equipment
- machine vision systems
- non-contact precision measurement
- AOI automated optical inspection
- AVI automated visual inspection
- Laser Via inspection
- PCB, HDI, and IC substrate inspection
- Wafer AVI inspection systems
- Wafer AOI inspection
- automated die visual inspection for advanced packaging