Kenturn Nano.Tec Co.,Ltd.

Exhibitor at SEMICON Taiwan 2026 · Booth Q5744

Booth Q5744Country TW2 product topics
Show facts

At a glance

BoothQ5744
CountryTW
Websitewww.kenturn.com.tw
Exhibitor profile

Company profile

Kenturn Nano.Tec Co.,Ltd. has been designing, manufacturing, fabricating and marketing machine tool spindles of all kinds since 1983. The company emphasizes intensive study of spindle design, development of innovative technology and continued improvement of teamwork between design and manufacturing. In the early stage of its spindle business, Kenturn developed the Kenturn precision spindle and later expanded into added-value spindle products including Direct-Drive and Precision Built-in Spindles. Kenturn states that its products help customers maintain equipment, resolve technological problems and reach production goals, linking spindle supply with support for machining performance. The company also describes itself as a spindle manufacturer that has manufactured all kinds of CNC cutting tools for over 40 years. For CNC machining centers, Kenturn presents itself as a professional spindle manufacturer established in 1983 and built around product R&D, expert engineers and product management. Kenturn states that its innovation and initiative guide its planning, complementing its continuing focus on spindle design and manufacturing development. Kenturn states that the Kenturn precision spindle established a unique level of quality in the early days of the industry.

Exhibitor profile

Exhibits

Kenturn's aerostatic spindle provides high rotational accuracy intended to support uniform silicon-wafer thickness and superior surface flatness. Its air-film damping is described as minimizing vibration and reducing micro-cracks during machining, linking spindle behavior directly to wafer-surface quality. The company has developed specialized spindles for semiconductor front-end processes including wafer slicing, edge grinding, thinning and grinding, and edge polishing. Aerostatic spindle and aerostatic rotary table are used for wafer thinning and grinding, including double-sided grinding that removes slicing marks from the wafer surface while improving Total Thickness Variation (TTV). Kenturn also supplies CNC Machining Center Spindles, which it identifies as a major component of a machining center because the spindle rotates cutting tools and provides movements required during machining. The machining-center spindle is described as an inner rotating shaft connected to an outer housing, with bearings inside the spindle providing support and resisting heat generated by friction during machining operations. A motor or servo powers the spindle to the desired speed for a specific cut, and spindle speed influences cut quality and the overall quality of the finished product. Kenturn notes that spindle speed can be changed through gears or different drive systems and that a quickly exchangeable design can change tooling configurations so one machine can output a variety of products. Named CNC machining-center spindle interfaces include BT30/BBT30/HSK-E40, BT40/BBT40/HSK-A63 and BT50/BBT50 /HSK - A100. Together, Kenturn's general CNC machining-center spindles and semiconductor aerostatic products cover machine-tool cutting applications and wafer slicing, edge grinding, thinning and grinding, and edge polishing. Within the CNC machining-center spindle range, BT30/BBT30/HSK-E40 is one named interface group. BT40/BBT40/HSK-A63 is listed as another CNC machining-center spindle interface group. BT50/BBT50 /HSK - A100 is also listed in the CNC machining-center spindle range.

Exhibitor profile

Capabilities and products

Topic group

Related product topics

On this site