At a glance
| Booth | R7001 |
| Country | TW |
| Product categories | Wafer Level Bonders · Etching; Stripping; Ashing - Dry and Wet Equipment · CMP; Grind; Lap; Polish; Abrasive materials |
Company profile
Based on the concept of “Gas & Energy”, we continuously develop a wide range of business in the four fields of “Energy”, “Industrial Gasses & Machinery” and “Materials”. This is done by creating a procurement and supply network in Japan and overseas as well as cultivating a variety of application technologies. As the semiconductor equipment industry technology is developing day by day, we, Iwatani have created a new concept machine mainly related semiconductor Wafers and packaging processes. For each process, we always focus to create a new concept machine and propose an inline system to meet each customer’s needs. Our policy is to establish total system knowhow to meet customer’s request and offer unique services to each customer. Through these initiatives, we contribute to people’s lives and the growth of the industry by developing and supplying society’s needs.
Capabilities and products
- CMP, grind, lap, and polish abrasive materials
- dry and wet etching, stripping, and ashing equipment
- inline systems for semiconductor processes
- semiconductor packaging process machines
- semiconductor wafer process machines
- wafer level bonders