At a glance
| Booth | P5718 |
| Country | TW |
| Website | www.hit-tw.com |
Company profile
Hantop Intelligence Tech. (HIT) was founded in 2018 and specializes in advanced-material processing technology products and smart automation modules, supported by a team dedicated to technology research and development. The company's non-contact power transmission ultrasonic-assisted machining module is compatible with traditional CNC machine-tool spindles and their automatic tool-change systems. By integrating with those conventional machine platforms, the module upgrades metal-processing CNC machine tools into high-precision processing equipment for advanced materials. The module processes hard, brittle and difficult-to-cut materials including ceramics such as alumina, zirconia and Macor, as well as quartz, fused silica, sapphire, Si, SiC, AlSiC, tungsten carbide, stainless steel, hardened steel and super alloys. HIT applies ultrasonic-assisted machining to semiconductor components including showerheads, quartz rings, wafer susceptors and heat sinks, and also addresses optical molds, aerospace and automotive parts such as EV components and brake discs, and precision molds. The machining approach is intended to improve tool life, processing efficiency and workpiece quality in CNC machining and has also demonstrated reduced workpiece edge chipping. Over the past years, HIT's ultrasonic-assisted machining modules have been integrated into more than 30 international machine-tool brands for end customers worldwide. End-customer adoption spans semiconductor, aerospace and automotive, optoelectronics and precision-mold industries in the United States, China, South Korea, Japan, India, Turkey, Singapore, Malaysia, Switzerland and other regions. The modules have been used to support stable production capacity in key semiconductor supply chains while improving tool life, processing efficiency and edge-chipping performance. HIT positions its advanced-material processing modules for global customers that need flexible integration with existing CNC equipment and support for difficult materials across precision manufacturing sectors.
Exhibits
The central offering is a non-contact power transmission ultrasonic-assisted machining module designed to work with conventional CNC spindles and automatic tool-change systems. For semiconductor machining, supported workpieces include showerheads, quartz rings, wafer susceptors and heat sinks made from hard, brittle or difficult-to-cut materials. The supported material set includes alumina, zirconia, Macor, quartz, fused silica, sapphire, Si, SiC, AlSiC, tungsten carbide, stainless steel, hardened steel and super alloys. The same module is used in optoelectronics for optical molds, in aerospace and automotive manufacturing for applications including EV components and brake discs, and in precision-mold production. Its demonstrated process benefits include longer tool life, higher processing efficiency, better workpiece quality and reduced edge chipping, with integration already completed across more than 30 international machine-tool brands.
Capabilities and products
- non-contact power-transmission ultrasonic-assisted machining modules
- machining of difficult materials including ceramics, quartz, sapphire and Si/SiC/AlSiC
- advanced-material processing products and smart automation modules